W9425G6JB-5 TR

IC DRAM 256MBIT PAR 60TFBGA
Part Description

IC DRAM 256MBIT PAR 60TFBGA

Quantity 1,296 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time55 nsGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of W9425G6JB-5 TR – IC DRAM 256MBIT PAR 60TFBGA

The W9425G6JB-5 TR from Winbond Electronics is a 256 Mbit DDR SDRAM device organized as 16M × 16 with an internal architecture described as 4 M × 4 banks × 16 bits. It implements a parallel DDR memory interface and is specified for operation with a clock frequency of 200 MHz and an access time of 55 ns.

Packaged in a 60-TFBGA (8×13) footprint, the device operates from a 2.3 V to 2.7 V supply and is specified for ambient temperatures from 0°C to 70°C, making it suitable for designs that require a compact, parallel DDR memory component with known timing and power characteristics.

Key Features

  • Memory architecture Organized as 16M × 16 with an internal configuration of 4 M × 4 banks × 16 bits, providing a defined DDR SDRAM banked structure and a total memory size of 256 Mbit.
  • DDR SDRAM technology Implements DDR SDRAM operation as specified in the device documentation for parallel data transfers.
  • Clock and timing Rated for a clock frequency of 200 MHz with an access time of 55 ns and a write cycle time (word/page) of 15 ns as listed in the specification set.
  • Voltage supply Operates from a 2.3 V to 2.7 V supply range, matching sub-3V system rails.
  • Package Supplied in a 60-TFBGA (8×13) package, suitable for board-level placement where a compact BGA footprint is required.
  • Operating temperature Specified ambient operating range of 0°C to 70°C (TA).

Typical Applications

  • Embedded memory expansion Use where a 256 Mbit parallel DDR SDRAM is required for system memory or frame/buffer storage.
  • Digital system memory Fits designs that require a 16M × 16 DDR organization with multiple banks for predictable read/write sequencing.
  • Board-level integration Suited for compact assemblies needing a 60-TFBGA footprint and a 2.3 V–2.7 V supply domain.

Unique Advantages

  • Compact 60-TFBGA footprint: Minimizes PCB area while providing a full 256 Mbit DDR SDRAM function in an 8×13 BGA.
  • Banked DDR organization: 4 M × 4 banks × 16 bits and 16M × 16 organization enable deterministic addressing and bank management as defined in the datasheet.
  • Defined timing envelope: 200 MHz clock rating with documented access time (55 ns) and write cycle time (15 ns) for integration into timing-sensitive designs.
  • Low-voltage compatibility: 2.3 V–2.7 V supply range supports systems with sub-3V power rails.
  • Commercial temperature rating: Specified for 0°C–70°C ambient operation for standard commercial environments.

Why Choose IC DRAM 256MBIT PAR 60TFBGA?

The W9425G6JB-5 TR is positioned as a compact, parallel DDR SDRAM option from Winbond Electronics offering a clear specification set—256 Mbit capacity, 16M × 16 organization, 200 MHz clock rating, and documented timing parameters. Its 60-TFBGA package and 2.3 V–2.7 V supply make it suitable for board-level integration where space and rail compatibility are considerations.

This device is appropriate for designs that require a defined banked DDR architecture and verifiable timing characteristics. The published datasheet provides the detailed electrical and timing information required for system integration and validation.

Request a quote or contact sales to discuss availability, lead times, and pricing for the W9425G6JB-5 TR.

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