W9751G6NB-18 TR

IC DRAM 512MBIT PAR 84VFBGA
Part Description

IC DRAM 512MBIT PAR 84VFBGA

Quantity 995 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerWinbond Electronics
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package84-VFBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time58.13 nsGradeCommercial (Extended)
Clock Frequency533 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 85°C (TC)Write Cycle Time Word Page15 nsPackaging84-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of W9751G6NB-18 TR – IC DRAM 512MBIT PAR 84VFBGA

The W9751G6NB-18 TR is a 512 Mbit DDR2 SDRAM device with a parallel memory interface in an 84-ball VFBGA package. It implements a 32M × 16 memory organization and an internal architecture described as 8M × 4 banks × 16 bit.

Designed for systems that require DDR2-class volatile memory at a 533 MHz clock rate, the device offers standard DDR2 control features and documented electrical and timing characteristics in the manufacturer datasheet. Key hardware attributes include a compact 84-VFBGA (8 × 12.5 mm) package, 1.7 V–1.9 V supply range, and a commercial operating temperature of 0 °C to 85 °C.

Key Features

  • Memory Core: 512 Mbit DDR2 SDRAM organized as 32M × 16 with an internal architecture noted as 8M × 4 banks × 16 bit, providing parallel DRAM storage.
  • Performance: Supports a clock frequency of 533 MHz and an access time of 58.13 ns; write cycle time (word page) specified at 15 ns for timing-sensitive designs.
  • Voltage and Power: Operates from a 1.7 V to 1.9 V supply range consistent with DDR2 power domains.
  • Package: 84-VFBGA (8 × 12.5 mm) BGA footprint for compact board-level integration.
  • Memory Interface: Parallel DRAM interface with DDR2 command and control support described in the datasheet (Mode Register Set, Extended Mode Registers, read/write/burst commands).
  • On-die Control and Modes: Datasheet documents features such as Mode Register and Extended Mode Registers (MRS/EMRS), DLL enable/disable, On-Die Termination (ODT), off-chip driver (OCD) impedance adjustment, self-refresh and power-down modes, and refresh operation commands.
  • Operating Range: Commercial temperature rating of 0 °C to 85 °C suitable for standard environment deployments.

Typical Applications

  • DDR2 system memory: Use as parallel DRAM storage in designs requiring 512 Mbit DDR2 memory and standard DDR2 command/control support.
  • Memory expansion modules: Suitable for board-level memory expansion where a compact 84-VFBGA footprint and 16-bit data bus are required.
  • Timing-sensitive designs: Applicable in systems that require documented access times, write cycle timing, and defined electrical/ac characteristics for integration and verification.

Unique Advantages

  • High-density DDR2 memory: 512 Mbit capacity in a single device reduces component count for mid-density memory requirements.
  • Documented DDR2 control features: Mode registers, EMRS, ODT, DLL control and refresh/power modes are detailed in the datasheet to support integration and initialization.
  • Compact BGA package: 84-VFBGA (8 × 12.5 mm) enables space-efficient board layouts where footprint is constrained.
  • Low-voltage operation: 1.7 V–1.9 V supply range aligns with DDR2 power domains to support standard power architectures.
  • Defined timing and electrical data: Access time (58.13 ns), clock frequency (533 MHz) and write cycle timing (15 ns) provide clear parameters for timing closure and system validation.
  • Commercial temperature coverage: Rated 0 °C to 85 °C for designs operating in typical commercial environments.

Why Choose W9751G6NB-18 TR?

The W9751G6NB-18 TR provides a documented DDR2 SDRAM option with 512 Mbit density, a 16-bit parallel interface, and a compact 84-ball VFBGA package. Its published electrical characteristics, command set support (MRS/EMRS, ODT, DLL controls), and timing data facilitate predictable integration and validation in DDR2-based designs.

This device is suited to engineers seeking a mid-density DDR2 memory component with clear timing and mode-control documentation for board-level implementation. The manufacturer-provided datasheet contains detailed operation modes, AC/DC characteristics, command timing, and initialization sequences to support design and test activities.

Request a quote or submit an inquiry to receive pricing and availability information for the W9751G6NB-18 TR.

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