W9751G6NB25I

The W9751G6NB25I is a 512 Mbit DDR2 SDRAM organized as 32M × 16 (8M × 4 banks × 16 bit) with a parallel memory interface. It operates with a 400 MHz clock and is targeted at systems requiring volatile DDR2 memory with configurable timing and termination options.

Designed for integration in designs that require a compact BGA footprint and industrial temperature capability, the device supports standard DDR2 command and mode register operations for flexible memory control.

Key Features

• DDR2 SDRAM Architecture — 512 Mbit capacity organized as 32M × 16 with 8M × 4 banks × 16 bit.
• Performance — 400 MHz clock frequency, 57.5 ns access time, and 15 ns write cycle time (word/page) for predictable DDR2 timing behavior.
• Voltage & Power — Operates from a 1.7 V to 1.9 V supply range.
• Package — 84‑VFBGA package (8 × 12.5 mm) for compact board integration.
• Temperature Range — Rated for operation from −40 °C to 95 °C (TC).
• Memory Interface — Parallel DDR2 memory interface supporting standard bank activate, read, write, auto-precharge, refresh, self-refresh and power-down commands.
• Mode & Termination Control — Device includes Mode Register and Extended Mode Register operations, with support for DLL enable/disable, On-Die Termination (ODT), and Off-Chip Driver (OCD) impedance adjustment as documented in the device specification.

Typical Applications

• Embedded memory subsystems — Used as parallel DDR2 DRAM for system working memory where a 32M × 16 organization and 400 MHz operation are required.
• Frame buffering and data buffering — Provides volatile storage for buffering applications that need DDR2 timing and parallel interface behavior.
• Industrial controllers — Suitable for temperature-critical designs due to its −40 °C to 95 °C operating range and compact VFBGA package.

Unique Advantages

• Consistent DDR2 timing: 400 MHz clock and documented access/write timings (57.5 ns access, 15 ns write cycle) enable predictable memory subsystem design.
• Flexible termination control: On-Die Termination (ODT) and OCD impedance adjustment accessible via Mode/Extended Mode Registers allow tuning of signal integrity parameters.
• Compact BGA footprint: 84‑VFBGA (8 × 12.5 mm) reduces PCB area while maintaining a full parallel DDR2 interface.
• Wide operating temperature: −40 °C to 95 °C rating supports deployments in harsher thermal environments.
• Standard DDR2 command support: Built-in support for activate, read/write, auto-precharge, refresh, self-refresh and power-down simplifies integration with standard memory controllers.

Why Choose IC DRAM 512MBIT PAR 84VFBGA?

The W9751G6NB25I provides a compact, fully documented DDR2 SDRAM option with a 512 Mbit capacity and 32M × 16 organization, suitable for designs that require parallel DDR2 memory running at 400 MHz. Its programmable mode registers, ODT and OCD features give designers control over termination and timing behavior to match system-level signal integrity and performance needs.

This device is appropriate for engineers and procurement teams specifying volatile DDR2 memory for embedded subsystems, buffering applications, and industrial designs that demand a small BGA package and extended temperature operation. The datasheet includes detailed command, timing and electrical specifications to support integration and validation in target systems.

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