NG80960JD3V66

IC MPU I960 66MHZ 132QFP
Part Description

i960 Microprocessor IC i960 1 Core, 32-Bit 66MHz 132-QFP

Quantity 1,101 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi960
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core Processori960Device Package132-QFPECCN3A001A3
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level4 (72 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 100°C (TC)Package / Case132-QFP
REACH ComplianceREACH UnknownRoHS ComplianceRoHS non-compliantSpeed66MHz
Supplier Device Package132-QFPVoltage – I/O3.3V

Overview of NG80960JD3V66 – IC MPU I960 66MHZ 132QFP

The NG80960JD3V66 is an Intel i960-series embedded microprocessor packaged in a 132-lead QFP for surface-mount assembly. It implements a single 32-bit core operating at 66 MHz and targets embedded applications that require deterministic instruction throughput, integrated memory support and a compact package footprint.

Built on the i960 architecture, the device combines single-instruction-per-clock execution with on-chip caches, on-chip RAM and an interrupt/timer subsystem to streamline real-time and control-focused system designs.

Key Features

  • Core and Architecture Single 32‑bit i960 core with one-instruction-per-clock execution and a load/store programming model for predictable performance.
  • Clock Rate 66 MHz core clock as specified for the NG80960JD3V66 variant, providing consistent execution timing for embedded control tasks.
  • Instruction and Data Cache Two-way set-associative instruction cache (JD variant: 4 KB) and direct-mapped data cache (JD variant: 2 KB) to reduce external memory accesses and improve code/data locality.
  • On‑Chip Memory 1 KB on-chip data RAM for critical variable storage with single-cycle access.
  • Interfaces and Bus High-bandwidth burst bus with 32‑bit multiplexed address/data and selectable 8/16/32-bit external bus widths; supports unaligned accesses and both big- and little-endian byte ordering.
  • Interrupts and Timers High-speed interrupt controller with up to 31 programmable priorities and two on-chip 32‑bit timers with clock prescaling options.
  • Power and I/O 3.3 V supply with 5 V tolerant inputs and TTL-compatible outputs for mixed-voltage interfacing; includes a halt mode for low-power operation.
  • Package and Mounting 132-lead Plastic Quad Flat Pack (132‑QFP) for surface-mount assembly, simplifying board layout in space-constrained systems.
  • Operating Range and Compliance Commercial grade operation from 0 °C to 100 °C and RoHS compliant.
  • Debug and Test IEEE 1149.1 (JTAG) boundary-scan compatibility for board-level test and debugging.

Typical Applications

  • Industrial Control — Deterministic execution, on-chip timers and robust interrupt handling make the NG80960JD3V66 suitable for PLCs, motion control and machine automation controllers.
  • Communications Equipment — High-bandwidth burst bus and selectable external bus widths support packet processing and embedded protocol handling in network devices.
  • Instrumentation and Test — On-chip RAM and caches plus precise interrupt/timer resources support real-time data acquisition and instrument control functions.
  • Embedded Appliances — Compact 132‑QFP package and mixed-voltage I/O capability enable integration into consumer and commercial embedded appliances that require 32-bit performance.

Unique Advantages

  • Predictable Execution Efficiency: One-instruction-per-clock architecture at 66 MHz simplifies timing analysis and real-time scheduling.
  • Integrated Memory Hierarchy: Combined instruction and data caches plus 1 KB on-chip RAM reduce external memory bandwidth needs and improve system responsiveness.
  • Flexible I/O Voltage Support: 3.3 V supply with 5 V tolerant inputs and TTL-compatible outputs eases interfacing with legacy and mixed-voltage peripherals.
  • Compact Surface-Mount Package: 132‑QFP packaging supports dense board layouts while maintaining access to a broad pinout for system functions.
  • Embedded System Friendliness: Programmable interrupt priorities, multiple timers and boundary-scan support simplify development and in-field diagnostics.
  • Compliance and Commercial Temperature Range: RoHS compliant and specified for 0 °C to 100 °C operation for commercial deployments.

Why Choose NG80960JD3V66?

The NG80960JD3V66 positions Intel’s i960 architecture in a compact, surface-mount form factor optimized for embedded designs that require consistent 32‑bit execution, integrated caches and on-chip resources. Its combination of predictable single-cycle instruction throughput, on-chip RAM and configurable external bus widths makes it a practical choice for control-oriented systems, communications modules and instrumentation.

Designed for commercial applications, the NG80960JD3V66 delivers a balanced mix of performance, integration and system-level interfaces to help reduce external component count and simplify board-level design decisions for embedded engineering teams.

Request a quote or submit an inquiry to receive pricing and availability information for NG80960JD3V66 and to discuss volume needs or lead-time requirements.

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