Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP4CE40F29C9LEP4CE40F29C9LIntelIC FPGA 532 I/O 780FBGAFPGAs780-FBGA (29x29)970 mV - 1.03 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
532
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Qualification:
N/A
Total RAM Bits:
1161216
897
EP4CE40F29C9LN
EP4CE40F29C9LNIntelIC FPGA 532 I/O 780FBGAFPGAs780-FBGA (29x29)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Total RAM Bits:
1161216
Number of I/O:
532
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
1,069
EP4CE40F29I7EP4CE40F29I7IntelIC FPGA 532 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
532
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Qualification:
N/A
Total RAM Bits:
1161216
840
EP4CE40F29I7N
EP4CE40F29I7NIntelIC FPGA 532 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Total RAM Bits:
1161216
Number of I/O:
532
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
593
EP4CE40F29I8L
EP4CE40F29I8LIntelIC FPGA 532 I/O 780FBGAFPGAs780-FBGA (29x29)0.97V ~ 1.03V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Total RAM Bits:
1161216
Number of I/O:
532
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
1,543
EP4CE40F29I8LNEP4CE40F29I8LNIntelIC FPGA 532 I/O 780FBGAFPGAs780-FBGA (29x29)970 mV - 1.03 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
532
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Qualification:
N/A
Total RAM Bits:
1161216
1,465
EP4CE40U19A7N
EP4CE40U19A7NIntelIC FPGA 328 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Total RAM Bits:
1161216
Number of I/O:
328
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
426
EP4CE40U19I7N
EP4CE40U19I7NIntelIC FPGA 328 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2475
Number of Logic Elements/Cells:
39600
Total RAM Bits:
1161216
Number of I/O:
328
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
290
EP4CE55F23A7N
EP4CE55F23A7NIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
982
EP4CE55F23C6
EP4CE55F23C6IntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
185
EP4CE55F23C6NEP4CE55F23C6NIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
324
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
716
EP4CE55F23C7
EP4CE55F23C7IntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
290
EP4CE55F23C7NEP4CE55F23C7NIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
324
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
1,088
EP4CE55F23C8
EP4CE55F23C8IntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,185
EP4CE55F23C8LEP4CE55F23C8LIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)970 mV - 1.03 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
324
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
829
EP4CE55F23C8LN
EP4CE55F23C8LNIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
733
EP4CE55F23C8NEP4CE55F23C8NIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
324
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
131
EP4CE55F23C9L
EP4CE55F23C9LIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
714
EP4CE55F23C9LN
EP4CE55F23C9LNIntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)0.97V ~ 1.03V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,016
EP4CE55F23I7
EP4CE55F23I7IntelIC FPGA 324 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
324
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,249

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