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Total Products: 3,238
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/AN/AS32G233AABK1VUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
817
GET A
QUOTE
N/AN/AS32G233ASBK0VUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
560
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QUOTE
N/AN/AS32G233ASBK0VUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
469
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QUOTE
N/AN/AS32G233ASBK1VUCRNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
306
GET A
QUOTE
N/AN/AS32G233ASBK1VUCTNXP SemiconductorsS32G233A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
1 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,381
GET A
QUOTE
N/AN/AS32G234MABK0VUCRNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE, LLCMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
GbE (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,716
GET A
QUOTE
N/AN/AS32G234MABK0VUCTNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE, LLCMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
GbE (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
311
GET A
QUOTE
N/AN/AS32G234MABK1VUCRNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE, LLCMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,072
GET A
QUOTE
N/AN/AS32G234MABK1VUCTNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE, LLCMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
680
GET A
QUOTE
N/AN/AS32G234MSBK0VUCRNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE W/PRMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
GbE (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,856
GET A
QUOTE
N/AN/AS32G234MSBK0VUCTNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE W/PRMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
GbE (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,314
GET A
QUOTE
N/AN/AS32G234MSBK1VUCRNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE W/PRMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
979
GET A
QUOTE
N/AN/AS32G234MSBK1VUCTNXP SemiconductorsS32G234M ARM CORTEX-M7, HSE W/PRMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 32/64-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
47
GET A
QUOTE
N/AN/AS32G254AABK0CUCRNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
161
GET A
QUOTE
N/AN/AS32G254AABK0CUCTNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
374
GET A
QUOTE
N/AN/AS32G254AABK0VUCRNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
401
GET A
QUOTE
N/AN/AS32G254AABK0VUCTNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
770
GET A
QUOTE
N/AN/AS32G254AABK1VUCRNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
152
GET A
QUOTE
N/AN/AS32G254AABK1VUCTNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
166
GET A
QUOTE
N/AN/AS32G254ASBK0VUCRNXP SemiconductorsS32G254A ARM CORTEX-M7 AND -A53,Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/2 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
GbE (4)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,181
GET A
QUOTE

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