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Total Products: 706
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
OMAPL132EZWTA2
OMAPL132EZWTA2Texas InstrumentsIC MPU OMAP-L1X 200MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Additional Interfaces:
AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART
1,178
OMAPL132EZWTA2E
OMAPL132EZWTA2ETexas InstrumentsIC MPU OMAP-L1X 200MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Additional Interfaces:
AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART
89
OMAPL132EZWTA2R
OMAPL132EZWTA2RTexas InstrumentsIC MPU OMAP-L1X 200MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Additional Interfaces:
AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART
1,102
OMAPL137AZKB3
OMAPL137AZKB3Texas InstrumentsIC MPU OMAP-L1X 300MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
400
OMAPL137BPTPH
OMAPL137BPTPHTexas InstrumentsIC MPU OMAP-L1X 300MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-55°C ~ 175°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-55°C ~ 175°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
752
OMAPL137BZKB3
OMAPL137BZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
1,251
OMAPL137BZKB4
OMAPL137BZKB4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
443
OMAPL137BZKBA3
OMAPL137BZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
565
OMAPL137BZKBD4
OMAPL137BZKBD4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
524
OMAPL137BZKBT3
OMAPL137BZKBT3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
1,185
OMAPL137CZKB3
OMAPL137CZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
836
OMAPL137CZKB4
OMAPL137CZKB4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
757
OMAPL137CZKBA3
OMAPL137CZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
353
OMAPL137CZKBD4
OMAPL137CZKBD4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
976
OMAPL137CZKBT3
OMAPL137CZKBT3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
1,068
OMAPL137DZKB3
OMAPL137DZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
1,707
OMAPL137DZKB4
OMAPL137DZKB4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
939
OMAPL137DZKBA3
OMAPL137DZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
1,506
OMAPL137DZKBD4
OMAPL137DZKBD4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
433
OMAPL137DZKBT3
OMAPL137DZKBT3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART
713

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