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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX513DJM8CMCIMX513DJM8CNXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
637
MCIMX513DJM8CR2MCIMX513DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-20°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
1,049
MCIMX514AJM6CN/AMCIMX514AJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
908
N/AMCIMX514AJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
1,100
MCIMX515CJM6CMCIMX515CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
541
MCIMX515CJM6CR2MCIMX515CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
199
MCIMX515DJM8CMCIMX515DJM8CNXP SemiconductorsIC MPU 800MHZ 529BGAMicroprocessors529-BGA Case 2017 (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA Case 2017 (19×19)
926
MCIMX515DJM8CR2MCIMX515DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
286
MCIMX515DVK8CMCIMX515DVK8CNXP SemiconductorsIC MPU I.MX51 800MHZ 527BGAMicroprocessors527-BGA (13x13)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
527-LFBGA
Supplier Device Package:
527-BGA (13×13)
1,080
MCIMX516AJM6CMCIMX516AJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
926
MCIMX516AJM6CR2MCIMX516AJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
564
MCIMX534AVP8C2MCIMX534AVP8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
879
MCIMX534AVP8C2R2MCIMX534AVP8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
681
MCIMX534AVV8BMCIMX534AVV8BNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)1.3V, 1.8V, 2.775V, 3.3V-40°C – 125°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
737
MCIMX534AVV8CMCIMX534AVV8CNXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
782
MCIMX534AVV8C2MCIMX534AVV8C2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
743
MCIMX534AVV8C2R2MCIMX534AVV8C2R2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
62
MCIMX534AVV8CR2MCIMX534AVV8CR2NXP SemiconductorsIC MPU I.MX53 800MHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (2)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,095
MCIMX535DVP1C2MCIMX535DVP1C2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
1,286
MCIMX535DVP1C2R2MCIMX535DVP1C2R2NXP SemiconductorsIC MPU I.MX53 1GHZ 529FBGAMicroprocessors529-FBGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 1.5Gbps (1)
USB:
USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
529-FBGA
Supplier Device Package:
529-FBGA (19×19)
744

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