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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/AN/AMIMX8DX1FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
156
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QUOTE
N/AN/AMIMX8DX1FVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
332
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QUOTE
N/AN/AMIMX8DX2AVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors-N/A–

N/A

637
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QUOTE
N/AN/AMIMX8DX2FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,464
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QUOTE
N/AN/AMIMX8DX2FVOFZACNXP SemiconductorsI.MX 8DUALXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
484
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QUOTE
N/AN/AMIMX8DX5AVLFZACRNXP SemiconductorsI.MX 8DUALXPLUSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,576
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QUOTE
MIMX8DX5CVLFZACN/AMIMX8DX5CVLFZACNXP SemiconductorsMIMX8DX5CVLFZACMicroprocessorsN/AN/AN/A

N/A

32
GET A
QUOTE
N/AN/AMIMX8DX5FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
891
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QUOTE
N/AN/AMIMX8DX5GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
441
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QUOTE
MIMX8DX6CVLFZACN/AMIMX8DX6CVLFZACNXP SemiconductorsMIMX8DX6CVLFZACMicroprocessorsN/AN/AN/A

N/A

344
GET A
QUOTE
N/AN/AMIMX8DX6FVLFZACNXP SemiconductorsI.MX 8DUALXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,287
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QUOTE
N/AN/AMIMX8DX6GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,119
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QUOTE
MIMX8MD6CVAHZAA
MIMX8MD6CVAHZAANXP SemiconductorsIC MPU I.MX8MD 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
1,584
GET A
QUOTE
MIMX8MD6CVAHZAB
MIMX8MD6CVAHZABNXP SemiconductorsIC MPU I.MX8MD 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
346
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QUOTE
MIMX8MD6DVAJZAA
MIMX8MD6DVAJZAANXP SemiconductorsIC MPU I.MX8MD 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
722
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QUOTE
MIMX8MD6DVAJZAB
MIMX8MD6DVAJZABNXP SemiconductorsIC MPU I.MX8MD 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
401
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QUOTE
MIMX8ML3CVNKZAB
MIMX8ML3CVNKZABNXP SemiconductorsIC MPU I.MX8ML 1.6GHZ 548LFBGAMicroprocessors548-LFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HTML, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GbE (2)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, RDC
Mounting Type:
Surface Mount
Package / Case:
548-LFBGA
Supplier Device Package:
548-LFBGA (15×15)
Additional Interfaces:
CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
1,452
GET A
QUOTE
MIMX8ML3DVNLZAB
MIMX8ML3DVNLZABNXP SemiconductorsIC MPU I.MX8ML 1.8GHZ 548LFBGAMicroprocessors548-LFBGA (15x15)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HTML, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GbE (2)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, RDC
Mounting Type:
Surface Mount
Package / Case:
548-LFBGA
Supplier Device Package:
548-LFBGA (15×15)
Additional Interfaces:
CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
1,380
GET A
QUOTE
MIMX8ML4CVNKZAB
MIMX8ML4CVNKZABNXP SemiconductorsIC MPU I.MX8ML 1.8GHZ 548LFBGAMicroprocessors548-LFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HTML, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GbE (2)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, RDC
Mounting Type:
Surface Mount
Package / Case:
548-LFBGA
Supplier Device Package:
548-LFBGA (15×15)
Additional Interfaces:
CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
644
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QUOTE
MIMX8ML4DVNLZAB
MIMX8ML4DVNLZABNXP SemiconductorsIC MPU I.MX8ML 1.8GHZ 548LFBGAMicroprocessors548-LFBGA (15x15)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
HTML, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GbE (2)
USB:
USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, RDC
Mounting Type:
Surface Mount
Package / Case:
548-LFBGA
Supplier Device Package:
548-LFBGA (15×15)
Additional Interfaces:
CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
1,262
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QUOTE

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