 | | M7AFS600-2FG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,720 | |
 | | M7AFS600-2FG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 434 | |
 | | M7AFS600-2FG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 408 | |
 | N/A | M7AFS600-2FGG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 1,535 | |
 | N/A | M7AFS600-2FGG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 915 | |
 | | M7AFS600-2FGG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,087 | |
 | N/A | M7AFS600-2FGG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 205 | |
 | | M7AFS600-FG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 880 | |
 | N/A | M7AFS600-FG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 1,830 | |
 | | M7AFS600-FG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,958 | |
 | N/A | M7AFS600-FG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 479 | |
 | | M7AFS600-FGG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,287 | |
 | N/A | M7AFS600-FGG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 108 | |
 | N/A | M7AFS600-FGG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 130 | |
 | N/A | M7AFS600-FGG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,591 | |
| N/A | | MCP2003-E/MD | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DFN | Drivers, Receivers, Transceivers | 8-DFN (4x4) | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-DFN (4×4) | 680 | |
 | | MCP2003-E/P | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DIP | Drivers, Receivers, Transceivers | 8-PDIP | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300″”, 7.62mm) Supplier Device Package: 8-PDIP | 515 | |
 | | MCP2003-E/SN | Microchip Technology | IC TRANSCEIVER HALF 1/1 8SOIC | Drivers, Receivers, Transceivers | 8-SOIC | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOIC | 278 | |
| N/A | | MCP2003A-E/MD | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DFN | Drivers, Receivers, Transceivers | 8-DFN (4x4) | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-DFN (4×4) | 818 | |
 | | MCP2003A-E/P | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DIP | Drivers, Receivers, Transceivers | 8-PDIP | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300″”, 7.62mm) Supplier Device Package: 8-PDIP | 294 | |