 | | M7AFS600-2FG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 264 | |
 | | M7AFS600-2FG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 501 | |
 | | M7AFS600-2FG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,286 | |
 | | M7AFS600-2FGG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 182 | |
 | | M7AFS600-2FGG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 842 | |
 | | M7AFS600-2FGG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,207 | |
 | | M7AFS600-2FGG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 140 | |
 | | M7AFS600-FG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 836 | |
 | | M7AFS600-FG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,707 | |
 | | M7AFS600-FG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,205 | |
 | | M7AFS600-FG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 99 | |
 | | M7AFS600-FGG256 | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 795 | |
 | | M7AFS600-FGG256I | Microchip Technology | IC FPGA 119 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,248 | |
 | | M7AFS600-FGG484 | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,389 | |
 | | M7AFS600-FGG484I | Microchip Technology | IC FPGA 172 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 46 | |
| N/A | | MCP2003-E/MD | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DFN | Drivers, Receivers, Transceivers | 8-DFN (4x4) | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-DFN (4×4) | 837 | |
 | | MCP2003-E/P | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DIP | Drivers, Receivers, Transceivers | 8-PDIP | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300″”, 7.62mm) Supplier Device Package: 8-PDIP | 1,367 | |
 | | MCP2003-E/SN | Microchip Technology | IC TRANSCEIVER HALF 1/1 8SOIC | Drivers, Receivers, Transceivers | 8-SOIC | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOIC | 10 | |
| N/A | | MCP2003A-E/MD | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DFN | Drivers, Receivers, Transceivers | 8-DFN (4x4) | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-DFN (4×4) | 1,495 | |
 | | MCP2003A-E/P | Microchip Technology | IC TRANSCEIVER HALF 1/1 8DIP | Drivers, Receivers, Transceivers | 8-PDIP | 6V ~ 27V | -40°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 175 mV Voltage – Supply: 6V ~ 27V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300″”, 7.62mm) Supplier Device Package: 8-PDIP | 1,074 | |