 | | 10AX016E4F29E3LG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 1,358 | |
 | | 10AX016E4F29E3SG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 501 | |
 | | 10AX016E4F29I3LG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 | 890 | |
 | | 10AX016E4F29I3SG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 | 71 | |
 | | 10AX022C3U19E2LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,899 | |
 | | 10AX022C3U19E2SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,542 | |
 | | 10AX022C3U19I2LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 177 | |
 | | 10AX022C3U19I2SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,690 | |
 | | 10AX022C4U19E3LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 18 | |
 | | 10AX022C4U19E3SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 184 | |
 | | 10AX022C4U19I3LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 785 | |
 | | 10AX022C4U19I3SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,151 | |
 | | 10AX022E3F27E1HG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,987 | |
 | | 10AX022E3F27E1SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,176 | |
 | | 10AX022E3F27E2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 456 | |
 | | 10AX022E3F27E2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,447 | |
 | | 10AX022E3F27I1HG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 847 | |
 | | 10AX022E3F27I1SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 482 | |
 | | 10AX022E3F27I2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,086 | |
 | | 10AX022E3F27I2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 966 | |