 | | 10AX016E4F29E3LG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 94 | |
 | | 10AX016E4F29E3SG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 992 | |
 | | 10AX016E4F29I3LG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 | 435 | |
 | | 10AX016E4F29I3SG | Intel | IC FPGA 288 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 61510 Number of Logic Elements/Cells: 160000 | 614 | |
 | | 10AX022C3U19E2LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 891 | |
 | | 10AX022C3U19E2SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 556 | |
 | | 10AX022C3U19I2LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 880 | |
 | | 10AX022C3U19I2SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 564 | |
 | | 10AX022C4U19E3LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 509 | |
 | | 10AX022C4U19E3SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 809 | |
 | | 10AX022C4U19I3LG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,513 | |
 | | 10AX022C4U19I3SG | Intel | IC FPGA 240 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,369 | |
 | | 10AX022E3F27E1HG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 891 | |
 | | 10AX022E3F27E1SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 530 | |
 | | 10AX022E3F27E2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 814 | |
 | | 10AX022E3F27E2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,800 | |
 | | 10AX022E3F27I1HG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 126 | |
 | | 10AX022E3F27I1SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,016 | |
 | | 10AX022E3F27I2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,742 | |
 | | 10AX022E3F27I2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,326 | |