 | | 10AX027E1F29E1HG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 187 | |
 | | 10AX027E1F29E1SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 1,449 | |
 | | 10AX027E1F29I1HG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 1,346 | |
 | | 10AX027E1F29I1SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 1,609 | |
 | | 10AX027E2F27E1HG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 1,929 | |
 | | 10AX027E2F27E1SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 1,448 | |
 | | 10AX027E2F27E2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,568 | |
 | | 10AX027E2F27E2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 1,706 | |
 | | 10AX027E2F27I1HG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 1,833 | |
 | | 10AX027E2F27I1SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 945 | |
 | | 10AX027E2F27I2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 113 | |
 | | 10AX027E2F27I2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 606 | |
 | | 10AX027E2F29E1HG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 86 | |
 | | 10AX027E2F29E1SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 1,172 | |
 | | 10AX027E2F29E2LG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 48 | |
 | | 10AX027E2F29E2SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 934 | |
 | | 10AX027E2F29I1HG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 221 | |
 | | 10AX027E2F29I1SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 438 | |
 | | 10AX027E2F29I2LG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 371 | |
 | | 10AX027E2F29I2SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 101620 Number of Logic Elements/Cells: 270000 | 213 | |