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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC68HC000RC16 | NXP Semiconductors | IC MPU M680X0 16MHZ 68PGA | Microprocessors | 68-PGA (26.92x26.92) | N/A | 0°C ~ 70°C (TA) | Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-PGA (26.92×26.92) | 1,033 | ||
 | MC68HC000RC8 | NXP Semiconductors | IC MPU M680X0 8MHZ 68PGA | Microprocessors | 68-PGA (26.92x26.92) | N/A | 0°C ~ 70°C (TA) | Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 8MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-PGA (26.92×26.92) | 731 | ||
 | MC68LC040FE25A | NXP Semiconductors | IC MPU M680X0 25MHZ 184CQFP | Microprocessors | 184-CQFP (31.3x31.3) | N/A | 0°C ~ 70°C (TA) | Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 184-BCQFP Supplier Device Package: 184-CQFP (31.3×31.3) Additional Interfaces: SCI, SPI | 479 | ||
 | MC68LC040RC25A | NXP Semiconductors | IC MPU M680X0 25MHZ 179PGA | Microprocessors | 179-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 179-BEPGA Supplier Device Package: 179-PGA (47.24×47.24) Additional Interfaces: SCI, SPI | 875 | ||
 | MC68LC040RC33A | NXP Semiconductors | IC MPU M680X0 33MHZ 179PGA | Microprocessors | 179-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 179-BEPGA Supplier Device Package: 179-PGA (47.24×47.24) Additional Interfaces: SCI, SPI | 300 | ||
 | MC68LC060BRC66 | NXP Semiconductors | IC MPU M680X0 66MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | -40°C ~ 70°C (TA) | Core Processor: 68060 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 206-BPGA Supplier Device Package: 206-PGA (47.25×47.25) Additional Interfaces: SCI, SPI | 61 | ||
 | MC68LC060RC50 | NXP Semiconductors | IC MPU M680X0 50MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | 0°C ~ 70°C (TA) | Core Processor: 68060 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 206-BPGA Supplier Device Package: 206-PGA (47.25×47.25) Additional Interfaces: SCI, SPI | 1,246 | ||
 | MC68LC060RC66 | NXP Semiconductors | IC MPU M680X0 66MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | 0°C ~ 70°C (TA) | Core Processor: 68060 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 206-BPGA Supplier Device Package: 206-PGA (47.25×47.25) Additional Interfaces: SCI, SPI | 730 | ||
 | MC68LC060RC75 | NXP Semiconductors | IC MPU M680X0 75MHZ 206PGA | Microprocessors | 206-PGA (47.25x47.25) | N/A | 0°C ~ 70°C (TA) | Core Processor: 68060 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 75MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 206-BPGA Supplier Device Package: 206-PGA (47.25×47.25) Additional Interfaces: SCI, SPI | 1,213 | ||
 | MC68LC302AF16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 509 | ||
 | MC68LC302AF16VCT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 1,582 | ||
 | MC68LC302AF20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 17 | ||
 | MC68LC302AF20VCT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 907 | ||
 | MC68LC302AF25CT | NXP Semiconductors | IC MPU M683XX 25MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 410 | ||
 | MC68LC302CAF16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 36 | ||
 | MC68LC302CAF20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 379 | ||
 | MC68LC302CPU16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 1,231 | ||
 | MC68LC302CPU20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 906 | ||
 | MC68LC302PU16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 407 | ||
 | MC68LC302PU16VCT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 16MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14×14) Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI | 716 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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