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Total Products: 357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
R9A07G054L14GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
51
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QUOTE
N/A
R9A07G054L14GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
400
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QUOTE
N/A
R9A07G054L17GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,549
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QUOTE
N/A
R9A07G054L17GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
119
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QUOTE
N/A
R9A07G054L18GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
446
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QUOTE
N/A
R9A07G054L18GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
634
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QUOTE
R9A07G054L23GBG#AC0
R9A07G054L23GBG#AC0RenesasIC MPU 200MHZ/1.2GHZ 456LFBGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
660
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QUOTE
N/A
R9A07G054L23GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
663
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QUOTE
R9A07G054L24GBG#AC0N/AR9A07G054L24GBG#AC0RenesasIC MPU 200MHZ/1.2GHZ 551LFBGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
358
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QUOTE
N/A
R9A07G054L24GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
13
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QUOTE
N/A
R9A07G054L27GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
246
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QUOTE
N/A
R9A07G054L27GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
632
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QUOTE
N/A
R9A07G054L28GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
165
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QUOTE
N/A
R9A07G054L28GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,488
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QUOTE
R9A07G063U01GBG#AC0
R9A07G063U01GBG#AC0RenesasIC MPU RZ/A3UL 1GHZ 361PBGAMicroprocessors361-PBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, MIPI/CSI2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-BGA
Supplier Device Package:
361-PBGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
87
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QUOTE
R9A07G063U01GBG#BC0
R9A07G063U01GBG#BC0RenesasIC MPU RZ/A3UL 1GHZ 361PBGAMicroprocessors361-PBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, MIPI/CSI2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-BGA
Supplier Device Package:
361-PBGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
1,532
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QUOTE
R9A07G063U02GBG#AC0
R9A07G063U02GBG#AC0RenesasIC MPU RZ/A3UL 1GHZ 361PBGAMicroprocessors361-PBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, MIPI/CSI2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-BGA
Supplier Device Package:
361-PBGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
1,492
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QUOTE
R9A07G063U02GBG#BC0
R9A07G063U02GBG#BC0RenesasIC MPU RZ/A3UL 1GHZ 361PBGAMicroprocessors361-PBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, MIPI/CSI2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-BGA
Supplier Device Package:
361-PBGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART
1,527
GET A
QUOTE
N/A
R9A07G074M01GBG#AC0RenesasRZ/T2L MPU BGA196 NON-ETHERCAT NMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 3.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, SCI, SPI, USB
1,292
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QUOTE
R9A07G074M04GBG#AC0
R9A07G074M04GBG#AC0RenesasRZ/T2L MPU BGA196 ETHERCAT NON-SMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R52
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 3.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, SCI, SPI, USB
730
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QUOTE

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