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Total Products: 357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R9A08G045S11GBG#BC0
R9A08G045S11GBG#BC0RenesasSOC RZ/G3S 13BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
229
R9A08G045S13GBG#AC0
R9A08G045S13GBG#AC0RenesasSOC RZ/G3S 14BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
1,200
R9A08G045S13GBG#BC0
R9A08G045S13GBG#BC0RenesasSOC RZ/G3S 14BGA NON-SECURE 1+1CMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
1,617
R9A08G045S15GBG#AC0
R9A08G045S15GBG#AC0RenesasSOC RZ/G3S 13BGA SECURE(BULK)Microprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
560
R9A08G045S15GBG#BC0
R9A08G045S15GBG#BC0RenesasSOC RZ/G3S 13BGA SECURE(FULL)Microprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
482
R9A08G045S17GBG#AC0
R9A08G045S17GBG#AC0RenesasSOC RZ/G3S 14BGA SECURE 1+1CPU(BMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
94
R9A08G045S17GBG#BC0
R9A08G045S17GBG#BC0RenesasSOC RZ/G3S 14BGA SECURE 1+1CPU(FMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
1,039
R9A08G045S35GBG#AC0
R9A08G045S35GBG#AC0RenesasSOC RZ/G3S 13BGA SECURE 1+2CPU(BMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
1,553
R9A08G045S35GBG#BC0
R9A08G045S35GBG#BC0RenesasSOC RZ/G3S 13BGA SECURE 1+2CPU(FMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART
1,863
R9A08G045S37GBG#AC0
R9A08G045S37GBG#AC0RenesasSOC RZ/G3S 14BGA SECURE 1+2CPU(BMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
1,142
R9A08G045S37GBG#BC0
R9A08G045S37GBG#BC0RenesasSOC RZ/G3S 14BGA SECURE 1+2CPU(FMicroprocessors361-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.1GHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
DDR4, LPDDR4
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (13×13)
Additional Interfaces:
DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART
87
N/AN/AR9A09G011GBG#ACCRenesasIC MPU RZ/V 996MHZ 841FBGAMicroprocessors841-FBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
996MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DP, HDMI, LCD
Ethernet:
GbE (1)
USB:
USB 3.1 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARC4, RSA, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
841-FBGA
Supplier Device Package:
841-FBGA (15×15)
Additional Interfaces:
CSI, GPIO, I2C, PCIe, SDI, USB
923
N/AN/AR9A09G011GBG#ACVRenesasIC MPU RZ/V 996MHZ 841FBGAMicroprocessors841-FBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
996MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, HDMI, LCD
Ethernet:
GbE (1)
USB:
USB 3.1 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARC4, RSA, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
841-FBGA
Supplier Device Package:
841-FBGA (15×15)
Additional Interfaces:
CSI, GPIO, I2C, PCIe, SDI, USB
746
N/AN/AR9A09G011GBG#BCCRenesasIC MPU RZ/V 996MHZ 841FBGAMicroprocessors841-FBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
996MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DP, HDMI, LCD
Ethernet:
GbE (1)
USB:
USB 3.1 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARC4, RSA, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
841-FBGA
Supplier Device Package:
841-FBGA (15×15)
Additional Interfaces:
CSI, GPIO, I2C, PCIe, SDI, USB
426
N/AN/AR9A09G011GBG#BCVRenesasIC MPU RZ/V 996MHZ 841FBGAMicroprocessors841-FBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
996MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, HDMI, LCD
Ethernet:
GbE (1)
USB:
USB 3.1 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARC4, RSA, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
841-FBGA
Supplier Device Package:
841-FBGA (15×15)
Additional Interfaces:
CSI, GPIO, I2C, PCIe, SDI, USB
591
N/A
R9A09G055MA3GBG#ACCRenesasIC MPU RZ/V2MA 996MHZ 841FBGAMicroprocessors841-FBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
996MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DP, HDMI, LCD
Ethernet:
GbE (1)
USB:
USB 3.1 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
841-FBGA
Supplier Device Package:
841-FBGA (15×15)
Additional Interfaces:
CSI, GPIO, I2C, PCIe, SDI, UART, USB
515
N/A
R9A09G055MA3GBG#BCCRenesasIC MPU RZ/V2MA 996MHZ 841FBGAMicroprocessors841-FBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
996MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
DP, HDMI, LCD
Ethernet:
GbE (1)
USB:
USB 3.1 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
841-FBGA
Supplier Device Package:
841-FBGA (15×15)
Additional Interfaces:
CSI, GPIO, I2C, PCIe, SDI, UART, USB
160
R9A09G057H41GBG#AC0
R9A09G057H41GBG#AC0RenesasRZ/V2H CA55 QUAD 19MM BULKMicroprocessorsN/AN/AN/A

N/A

753
R9A09G057H41GBG#BC0
R9A09G057H41GBG#BC0RenesasRZ/V2H CA55 QUAD 19MM FULLMicroprocessorsN/AN/AN/A

N/A

942
R9A09G057H42GBG#AC0
R9A09G057H42GBG#AC0RenesasRZ/V2H CA55 QUAD GPU 19MM BULKMicroprocessorsN/AN/AN/A

N/A

625

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