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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6G3DVK05AB
MCIMX6G3DVK05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 272MAPBGAMicroprocessors272-MAPBGA (9x9)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
272-LFBGA
Supplier Device Package:
272-MAPBGA (9×9)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
969
MCIMX6G3DVM05AA
MCIMX6G3DVM05AANXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
1,096
MCIMX6G3DVM05AA-NXP
MCIMX6G3DVM05AA-NXPNXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
1,096
MCIMX6G3DVM05AB
MCIMX6G3DVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
1,010
MCIMX6L2DVN10AA
MCIMX6L2DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,194
N/A
MCIMX6L2DVN10ABNXP SemiconductorsIC MPU I.MX6 1GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.2V, 1.8V, 3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
517
MCIMX6L2DVN10AC
MCIMX6L2DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
447
MCIMX6L2EVN10AB
MCIMX6L2EVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,791
MCIMX6L2EVN10ABR
MCIMX6L2EVN10ABRNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,579
MCIMX6L2EVN10AC
MCIMX6L2EVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
74
MCIMX6L2EVN10ACR
MCIMX6L2EVN10ACRNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
780
MCIMX6L3DVN10AA
MCIMX6L3DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,871
MCIMX6L3DVN10AB
MCIMX6L3DVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,381
MCIMX6L3DVN10AC
MCIMX6L3DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,828
MCIMX6L3EVN10AB
MCIMX6L3EVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
556
MCIMX6L3EVN10AC
MCIMX6L3EVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
414
MCIMX6L7DVN10AB
MCIMX6L7DVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
770
MCIMX6L7DVN10AC
MCIMX6L7DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
657
MCIMX6L8DVN10AA
MCIMX6L8DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
829
MCIMX6L8DVN10AA-NXP
MCIMX6L8DVN10AA-NXPNXP SemiconductorsI.MX 6 SERIES 32 BIT MPU, ARM COMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.2V, 1.8V, 3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
81

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