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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
MCIMX6G3DVK05AB
MCIMX6G3DVK05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 272MAPBGAMicroprocessors272-MAPBGA (9x9)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
272-LFBGA
Supplier Device Package:
272-MAPBGA (9×9)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
274
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QUOTE
MCIMX6G3DVM05AA
MCIMX6G3DVM05AANXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
635
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MCIMX6G3DVM05AA-NXP
MCIMX6G3DVM05AA-NXPNXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
480
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QUOTE
MCIMX6G3DVM05AB
MCIMX6G3DVM05ABNXP SemiconductorsIC MPU I.MX6UL 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
186
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QUOTE
MCIMX6L2DVN10AA
MCIMX6L2DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
156
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QUOTE
N/A
MCIMX6L2DVN10ABNXP SemiconductorsIC MPU I.MX6 1GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.2V, 1.8V, 3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,515
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QUOTE
MCIMX6L2DVN10AC
MCIMX6L2DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,065
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QUOTE
MCIMX6L2EVN10AB
MCIMX6L2EVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
807
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QUOTE
MCIMX6L2EVN10ABR
MCIMX6L2EVN10ABRNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
984
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QUOTE
MCIMX6L2EVN10AC
MCIMX6L2EVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
696
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QUOTE
MCIMX6L2EVN10ACR
MCIMX6L2EVN10ACRNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
577
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QUOTE
MCIMX6L3DVN10AA
MCIMX6L3DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
917
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QUOTE
MCIMX6L3DVN10AB
MCIMX6L3DVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
655
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QUOTE
MCIMX6L3DVN10AC
MCIMX6L3DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
956
GET A
QUOTE
MCIMX6L3EVN10AB
MCIMX6L3EVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,872
GET A
QUOTE
MCIMX6L3EVN10AC
MCIMX6L3EVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
61
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QUOTE
MCIMX6L7DVN10AB
MCIMX6L7DVN10ABNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
8
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QUOTE
MCIMX6L7DVN10AC
MCIMX6L7DVN10ACNXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
97
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QUOTE
MCIMX6L8DVN10AA
MCIMX6L8DVN10AANXP SemiconductorsIC MPU I.MX6SL 1.0GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (3)
Voltage – I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
1,312
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QUOTE
MCIMX6L8DVN10AA-NXP
MCIMX6L8DVN10AA-NXPNXP SemiconductorsI.MX 6 SERIES 32 BIT MPU, ARM COMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.2V, 1.8V, 3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
737
GET A
QUOTE

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    Tap into our global network of suppliers to find the components you need. We simplify procurement, even for hard-to-find parts, saving you time and ensuring smooth production.

    Second Sourcing  Second Sourcing Solutions

    Don’t let supply chain disruptions delay your project. We’ll help you identify alternative components and secure reliable secondary sources to keep your production on track.

    Obsolescence Management  Obsolescence Management

    Outsmart obsolescence and ensure your designs stay in production. We’ll help you navigate component lifecycles, secure long-term supply, and find smart alternatives when parts are discontinued.

    Shortage Mitigation  Shortage Mitigation

    Forget supply chain worries. Our team specializes in navigating the unpredictable component market, leveraging our global network and deep expertise to help you find the necessary components when you need them.

























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