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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
S32G378AACK1VUCTN/AS32G378AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
924
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QUOTE
N/AN/AS32G378ASAK1VUCRNXP SemiconductorsMICROPROCESSORS - MPU 4X CORTEX-Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,831
GET A
QUOTE
N/AN/AS32G378ASAK1VUCTNXP SemiconductorsMICROPROCESSORS - MPU 4X CORTEX-Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,257
GET A
QUOTE
N/AN/AS32G378ASCK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,333
GET A
QUOTE
N/AN/AS32G378ASCK1VUCTNXP Semiconductors4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
12
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QUOTE
N/AN/AS32G379AACK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
888
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QUOTE
S32G379AACK1VUCTN/AS32G379AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
239
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QUOTE
N/AN/AS32G379ASCK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,337
GET A
QUOTE
N/AN/AS32G379ASCK1VUCTNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
976
GET A
QUOTE
N/AN/AS32G398AAAK1VUCTNXP Semiconductors3XM7 400MHZ, 8XA53 1GHZ, 525BGMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
489
GET A
QUOTE
N/AN/AS32G398AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,183
GET A
QUOTE
N/AN/AS32G398AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
549
GET A
QUOTE
S32G398AACK1VUCTN/AS32G398AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
1,706
GET A
QUOTE
N/AN/AS32G398ASAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
315
GET A
QUOTE
N/AN/AS32G398ASCK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,032
GET A
QUOTE
N/AN/AS32G398ASCK1VUCTNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
256
GET A
QUOTE
N/AN/AS32G399AAAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
16
GET A
QUOTE
N/AN/AS32G399AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
360
GET A
QUOTE
N/AN/AS32G399AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
164
GET A
QUOTE
S32G399AACK1VUCTN/AS32G399AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
771
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QUOTE

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