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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
S32G378AACK1VUCT
S32G378AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
344
GET A
QUOTE
N/AN/AS32G378ASAK1VUCRNXP SemiconductorsMICROPROCESSORS - MPU 4X CORTEX-Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
603
GET A
QUOTE
N/AN/AS32G378ASAK1VUCTNXP SemiconductorsMICROPROCESSORS - MPU 4X CORTEX-Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR4
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
419
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QUOTE
N/AN/AS32G378ASCK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,095
GET A
QUOTE
N/AN/AS32G378ASCK1VUCTNXP Semiconductors4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
659
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QUOTE
N/AN/AS32G379AACK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
97
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QUOTE
S32G379AACK1VUCT
S32G379AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
1,029
GET A
QUOTE
N/AN/AS32G379ASCK1VUCRNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,799
GET A
QUOTE
N/AN/AS32G379ASCK1VUCTNXP Semiconductors4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,358
GET A
QUOTE
N/AN/AS32G398AAAK1VUCTNXP Semiconductors3XM7 400MHZ, 8XA53 1GHZ, 525BGMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
36
GET A
QUOTE
N/AN/AS32G398AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
508
GET A
QUOTE
N/AN/AS32G398AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
154
GET A
QUOTE
S32G398AACK1VUCT
S32G398AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
250
GET A
QUOTE
N/AN/AS32G398ASAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
1,365
GET A
QUOTE
N/AN/AS32G398ASCK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
615
GET A
QUOTE
N/AN/AS32G398ASCK1VUCTNXP Semiconductors8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
3 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
430
GET A
QUOTE
N/AN/AS32G399AAAK1VUCTNXP Semiconductors8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, TRNG
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
516
GET A
QUOTE
N/AN/AS32G399AABK1VUCTNXP Semiconductors8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
1.1GHz, 400MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
977
GET A
QUOTE
N/AN/AS32G399AACK1VUCRNXP Semiconductors8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2Microprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
491
GET A
QUOTE
S32G399AACK1VUCT
S32G399AACK1VUCTNXP SemiconductorsIC MPU S32G3 1.3GZ/400MHZ 525BGAMicroprocessors525-FCPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width:
4 Core, 64-Bit/8 Core, 32-Bit
Speed:
400MHz, 1.3GHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Ethernet:
2.5Gbps (3)
USB:
USB 2.0 OTG (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Mounting Type:
Surface Mount
Package / Case:
525-FBGA, FCBGA
Supplier Device Package:
525-FCPBGA (19×19)
Additional Interfaces:
CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
216
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QUOTE

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