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Total Products: 220,011
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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XPC8260CZUHFBC
XPC8260CZUHFBCNXP SemiconductorsIC MPU MPC82XX 166MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
129
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XPC8260CZUIHBC
XPC8260CZUIHBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
1,179
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XPC8260VVHFBC
XPC8260VVHFBCNXP SemiconductorsIC MPU MPC82XX 166MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
1,291
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XPC8260VVIFBC
XPC8260VVIFBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
1,232
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XPC8260ZUHFBC
XPC8260ZUHFBCNXP SemiconductorsIC MPU MPC82XX 166MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
347
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XPC8260ZUIFBC
XPC8260ZUIFBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
1,313
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XPC8260ZUIHBC
XPC8260ZUIHBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
165
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XPC850CZT50BU
XPC850CZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
304
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XPC850DECVR50BU
XPC850DECVR50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
750
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XPC850DECZT50BU
XPC850DECZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
502
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XPC850DEZT50BT
XPC850DEZT50BTNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
261
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XPC850DEZT50BU
XPC850DEZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
872
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XPC850DSLCZT50BU
XPC850DSLCZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
478
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XPC850DSLZT50BU
XPC850DSLZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
246
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XPC850SRZT50BU
XPC850SRZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
941
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XPC850ZT50BU
XPC850ZT50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
1,202
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XRM41L232PZT
XRM41L232PZTTexas InstrumentsIC MCU 16/32B 128KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
POR, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,161
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XRM42L432PZT
XRM42L432PZTTexas InstrumentsIC MCU 16/32B 384KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4
Core Size:
16/32-Bit
Speed:
100MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
87
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XRM44L520APZT
XRM44L520APZTTexas InstrumentsIC MCU 32BIT 768KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
120MHz
Connectivity:
CANbus, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,205
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XRM46L852PGET
XRM46L852PGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,419
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