 | | 10AX032E3F27E2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 863 | |
 | | 10AX032E3F27E2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 807 | |
 | | 10AX032E3F27I2LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,137 | |
 | | 10AX032E3F27I2SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 526 | |
 | | 10AX032E3F29E2LG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 1,067 | |
 | | 10AX032E3F29E2SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 1,564 | |
 | | 10AX032E3F29I2LG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 710 | |
 | | 10AX032E3F29I2SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 1,086 | |
 | | 10AX032E4F27E3LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 557 | |
 | | 10AX032E4F27E3SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 346 | |
 | | 10AX032E4F27I3LG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 663 | |
 | | 10AX032E4F27I3SG | Intel | IC FPGA 240 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 958 | |
 | | 10AX032E4F29E3LG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 1,376 | |
 | | 10AX032E4F29E3SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 187 | |
 | | 10AX032E4F29I3LG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 414 | |
 | | 10AX032E4F29I3SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 685 | |
 | | 10AX032H1F34E1HG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FCBGA (35x35) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35×35) | 120 | |
 | | 10AX032H1F34E1SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FCBGA (35x35) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 29 | |
 | | 10AX032H1F34I1HG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FCBGA (35x35) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35×35) | 521 | |
 | | 10AX032H1F34I1SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FCBGA (35x35) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 266 | |