 | | 10AX032H3F34E2LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 808 | |
 | | 10AX032H3F34E2SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 1,289 | |
 | | 10AX032H3F34I2LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 674 | |
 | | 10AX032H3F34I2SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 1,106 | |
 | | 10AX032H3F35E2LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 870 mV - 930 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 360 | |
 | | 10AX032H3F35E2SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 543 | |
 | | 10AX032H3F35I2LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 719 | |
 | | 10AX032H3F35I2SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 427 | |
 | | 10AX032H4F34E3LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 639 | |
 | | 10AX032H4F34E3SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 363 | |
 | | 10AX032H4F34I3LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 823 | |
 | | 10AX032H4F34I3SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 917 | |
 | | 10AX032H4F35E3LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 479 | |
 | | 10AX032H4F35E3SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 1,320 | |
 | | 10AX032H4F35I3LG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 0.87V ~ 0.98V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 585 | |
 | | 10AX032H4F35I3SG | Intel | IC FPGA 384 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 | 540 | |
 | | 10AX048E1F29E1HG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | 0°C – 100°C | Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 | 516 | |
 | | 10AX048E1F29E1SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.87V ~ 0.98V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Voltage – Supply: 0.87V ~ 0.98V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 63 | |
 | | 10AX048E1F29I1HG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 | 785 | |
 | | 10AX048E1F29I1SG | Intel | IC FPGA 360 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 870 mV - 980 mV | -40°C – 100°C | Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 | 869 | |