 | | 5AGZME1E3H29C4N | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 459 | |
 | | 5AGZME1E3H29I4G | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 | 455 | |
 | | 5AGZME1E3H29I4N | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 878 | |
 | | 5AGZME1H2F35C3G | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 | 1,344 | |
 | | 5AGZME1H2F35C3N | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 791 | |
 | | 5AGZME1H2F35I3LG | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 | 835 | |
 | | 5AGZME1H2F35I3LN | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 822 | |
 | | 5AGZME1H3F35C4G | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 54 | |
 | | 5AGZME1H3F35C4N | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 41 | |
 | | 5AGZME1H3F35I4G | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 764 | |
 | | 5AGZME1H3F35I4N | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 10377 Number of Logic Elements/Cells: 220000 | 983 | |
 | | 5AGZME3E2H29C3G | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 678 | |
 | | 5AGZME3E2H29C3N | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 85 | |
 | | 5AGZME3E2H29I3LG | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 | 1,003 | |
 | | 5AGZME3E2H29I3LN | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 | 491 | |
 | | 5AGZME3E3H29C4G | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 261 | |
 | | 5AGZME3E3H29C4N | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 749 | |
 | | 5AGZME3E3H29I4G | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 625 | |
 | | 5AGZME3E3H29I4N | Intel | IC FPGA 342 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 | 604 | |
 | | 5AGZME3H2F35C3G | Intel | IC FPGA 414 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 | 160 | |