Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
5CGXBC9E6F35C7N
5CGXBC9E6F35C7NIntelIC FPGA 560 I/O 1152FBGAFPGAs1152-FBGA (35x35)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
113560
Number of Logic Elements/Cells:
301000
Total RAM Bits:
14251008
Number of I/O:
560
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BGA
Supplier Device Package:
1152-FBGA (35×35)
1,966
5CGXBC9E7F31C8N5CGXBC9E7F31C8NIntelIC FPGA 480 I/O 896FBGAFPGAs896-FBGA (31x31)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
480
Number of LABs/CLBs:
113560
Number of Logic Elements/Cells:
301000
Qualification:
N/A
Total RAM Bits:
14251008
1,025
5CGXBC9E7F35C8N
5CGXBC9E7F35C8NIntelIC FPGA 560 I/O 1152FBGAFPGAs1152-FBGA (35x35)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
113560
Number of Logic Elements/Cells:
301000
Total RAM Bits:
14251008
Number of I/O:
560
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BGA
Supplier Device Package:
1152-FBGA (35×35)
1,427
5CGXFC3B6F23C6N
5CGXFC3B6F23C6NIntelIC FPGA 208 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,141
5CGXFC3B6F23C7N
5CGXFC3B6F23C7NIntelIC FPGA 208 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
216
5CGXFC3B6F23I7
5CGXFC3B6F23I7IntelIC FPGA 208 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
36000
Total RAM Bits:
1568768
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
85
5CGXFC3B6F23I7N
5CGXFC3B6F23I7NIntelIC FPGA 208 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
733
5CGXFC3B6U15A7N
5CGXFC3B6U15A7NIntelIC FPGA 144 I/O 324UBGAFPGAs324-UBGA (15x15)1.07V ~ 1.13V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
144
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
324-LFBGA
Supplier Device Package:
324-UBGA (15×15)
194
5CGXFC3B6U15C6N
5CGXFC3B6U15C6NIntelIC FPGA 144 I/O 324UBGAFPGAs324-UBGA (15x15)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
144
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA
Supplier Device Package:
324-UBGA (15×15)
1,375
5CGXFC3B6U15C7N
5CGXFC3B6U15C7NIntelIC FPGA 144 I/O 324UBGAFPGAs324-UBGA (15x15)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
144
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA
Supplier Device Package:
324-UBGA (15×15)
36
5CGXFC3B6U15I7N5CGXFC3B6U15I7NIntelIC FPGA 144 I/O 324UBGAFPGAs324-UBGA (15x15)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
144
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Qualification:
N/A
Total RAM Bits:
1381376
298
5CGXFC3B6U19A7N5CGXFC3B6U19A7NIntelIC FPGA 208 I/O 484UBGAFPGAs484-UBGA (19x19)1.07 V - 1.13 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
208
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Qualification:
AEC-Q100
Total RAM Bits:
1381376
1,015
5CGXFC3B6U19C6N5CGXFC3B6U19C6NIntelIC FPGA 208 I/O 484UBGAFPGAs484-UBGA (19x19)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
208
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Qualification:
N/A
Total RAM Bits:
1381376
666
5CGXFC3B6U19C7N
5CGXFC3B6U19C7NIntelIC FPGA 208 I/O 484UBGAFPGAs484-UBGA (19x19)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
1,371
5CGXFC3B6U19I7N
5CGXFC3B6U19I7NIntelIC FPGA 208 I/O 484UBGAFPGAs484-UBGA (19x19)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
229
5CGXFC3B7F23C8N5CGXFC3B7F23C8NIntelIC FPGA 208 I/O 484FBGAFPGAs484-FBGA (23x23)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
208
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Qualification:
N/A
Total RAM Bits:
1381376
582
5CGXFC3B7U15C8N
5CGXFC3B7U15C8NIntelIC FPGA 144 I/O 324UBGAFPGAs324-UBGA (15x15)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
144
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA
Supplier Device Package:
324-UBGA (15×15)
1,695
5CGXFC3B7U19C8N
5CGXFC3B7U19C8NIntelIC FPGA 208 I/O 484UBGAFPGAs484-UBGA (19x19)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
11900
Number of Logic Elements/Cells:
31500
Total RAM Bits:
1381376
Number of I/O:
208
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
104
5CGXFC4C6F23C6N5CGXFC4C6F23C6NIntelIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Qualification:
N/A
Total RAM Bits:
2862080
1,205
5CGXFC4C6F23C7N
5CGXFC4C6F23C7NIntelIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
240
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,264

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up