Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
5CGXFC4C6F23I7N
5CGXFC4C6F23I7NIntelIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
240
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,082
5CGXFC4C6F27C6N
5CGXFC4C6F27C6NIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
336
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
1,667
5CGXFC4C6F27C7N
5CGXFC4C6F27C7NIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
336
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
1,097
5CGXFC4C6F27I7N5CGXFC4C6F27I7NIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
336
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Qualification:
N/A
Total RAM Bits:
2862080
860
5CGXFC4C6M13C6N
5CGXFC4C6M13C6NIntelIC FPGA 175 I/O 383MBGAFPGAs383-MBGA (13x13)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
175
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
383-TFBGA
Supplier Device Package:
383-MBGA (13×13)
998
5CGXFC4C6M13C7N
5CGXFC4C6M13C7NIntelIC FPGA 175 I/O 383MBGAFPGAs383-MBGA (13x13)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
175
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
383-TFBGA
Supplier Device Package:
383-MBGA (13×13)
1,013
5CGXFC4C6M13I7N
5CGXFC4C6M13I7NIntelIC FPGA 175 I/O 383MBGAFPGAs383-MBGA (13x13)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
175
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
383-TFBGA
Supplier Device Package:
383-MBGA (13×13)
526
5CGXFC4C6U19A7N
5CGXFC4C6U19A7NIntelIC FPGA 224 I/O 484UBGAFPGAs484-UBGA (19x19)1.07V ~ 1.13V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
224
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
134
5CGXFC4C6U19C6N5CGXFC4C6U19C6NIntelIC FPGA 224 I/O 484UBGAFPGAs484-UBGA (19x19)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
224
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Qualification:
N/A
Total RAM Bits:
2862080
1,330
5CGXFC4C6U19C7N
5CGXFC4C6U19C7NIntelIC FPGA 224 I/O 484UBGAFPGAs484-UBGA (19x19)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
224
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
618
5CGXFC4C6U19I7N5CGXFC4C6U19I7NIntelIC FPGA 224 I/O 484UBGAFPGAs484-UBGA (19x19)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
224
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Qualification:
N/A
Total RAM Bits:
2862080
327
5CGXFC4C7F23C8N
5CGXFC4C7F23C8NIntelIC FPGA 240 I/O 484FBGAFPGAs484-FBGA (23x23)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
240
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
1,601
5CGXFC4C7F27C8N
5CGXFC4C7F27C8NIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
336
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27×27)
113
5CGXFC4C7M13C8N
5CGXFC4C7M13C8NIntelIC FPGA 175 I/O 383MBGAFPGAs383-MBGA (13x13)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
175
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
383-TFBGA
Supplier Device Package:
383-MBGA (13×13)
588
5CGXFC4C7U19C8N
5CGXFC4C7U19C8NIntelIC FPGA 224 I/O 484UBGAFPGAs484-UBGA (19x19)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
224
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
523
5CGXFC4F6M11C6N
5CGXFC4F6M11C6NIntelIC FPGA 129 I/O 301MBGAFPGAs301-MBGA (11x11)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
129
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
301-TFBGA
Supplier Device Package:
301-MBGA (11×11)
773
5CGXFC4F6M11C7N
5CGXFC4F6M11C7NIntelIC FPGA 129 I/O 301MBGAFPGAs301-MBGA (11x11)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
129
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
301-TFBGA
Supplier Device Package:
301-MBGA (11×11)
1,575
5CGXFC4F6M11I75CGXFC4F6M11I7IntelIC FPGA 129 I/O 301MBGAFPGAs301-MBGA (11x11)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
129
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Qualification:
N/A
Total RAM Bits:
2862080
1,684
5CGXFC4F6M11I7N5CGXFC4F6M11I7NIntelIC FPGA 129 I/O 301MBGAFPGAs301-MBGA (11x11)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
129
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Qualification:
N/A
Total RAM Bits:
2862080
1,898
5CGXFC4F7M11C8N
5CGXFC4F7M11C8NIntelIC FPGA 129 I/O 301MBGAFPGAs301-MBGA (11x11)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18868
Number of Logic Elements/Cells:
50000
Total RAM Bits:
2862080
Number of I/O:
129
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
301-TFBGA
Supplier Device Package:
301-MBGA (11×11)
1,763

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