Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC6SLX25T-3FGG484CXC6SLX25T-3FGG484CAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
250
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,087
XC6SLX25T-3FGG484IXC6SLX25T-3FGG484IAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
250
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
444
XC6SLX25T-4CSG324CXC6SLX25T-4CSG324CAdvanced Micro DevicesIC FPGA 190 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
190
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
296
XC6SLX25T-4FGG484CXC6SLX25T-4FGG484CAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
250
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,289
XC6SLX25T-N3CSG324CXC6SLX25T-N3CSG324CAdvanced Micro DevicesIC FPGA 190 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
190
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
1,362
XC6SLX25T-N3CSG324IXC6SLX25T-N3CSG324IAdvanced Micro DevicesIC FPGA 190 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
190
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
1,299
XC6SLX25T-N3FG484CXC6SLX25T-N3FG484CAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
250
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
795
XC6SLX25T-N3FGG484CXC6SLX25T-N3FGG484CAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
250
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
740
XC6SLX4-2CPG196CXC6SLX4-2CPG196CAdvanced Micro DevicesIC FPGA 106 I/O 196CSBGAFPGAs196-CSPBGA (8x8)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
106
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
196-TFBGA, CSBGA
Supplier Device Package:
196-CSPBGA (8×8)
36
XC6SLX4-2CPG196IXC6SLX4-2CPG196IAdvanced Micro DevicesIC FPGA 106 I/O 196CSBGAFPGAs196-CSPBGA (8x8)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
106
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
196-TFBGA, CSBGA
Supplier Device Package:
196-CSPBGA (8×8)
1,053
XC6SLX4-2CSG225CXC6SLX4-2CSG225CAdvanced Micro DevicesIC FPGA 132 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
132
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Qualification:
N/A
Total RAM Bits:
221184
1,842
XC6SLX4-2CSG225IXC6SLX4-2CSG225IAdvanced Micro DevicesIC FPGA 132 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
132
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
225-LFBGA, CSPBGA
Supplier Device Package:
225-CSPBGA (13×13)
1,726
XC6SLX4-2TQG144CXC6SLX4-2TQG144CAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
102
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
412
XC6SLX4-2TQG144IXC6SLX4-2TQG144IAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
102
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Qualification:
N/A
Total RAM Bits:
221184
201
XC6SLX4-3CPG196CXC6SLX4-3CPG196CAdvanced Micro DevicesIC FPGA 106 I/O 196CSBGAFPGAs196-CSPBGA (8x8)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
106
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
196-TFBGA, CSBGA
Supplier Device Package:
196-CSPBGA (8×8)
892
XC6SLX4-3CPG196IXC6SLX4-3CPG196IAdvanced Micro DevicesIC FPGA 106 I/O 196CSBGAFPGAs196-CSPBGA (8x8)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
106
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
196-TFBGA, CSBGA
Supplier Device Package:
196-CSPBGA (8×8)
838
XC6SLX4-3CSG225CXC6SLX4-3CSG225CAdvanced Micro DevicesIC FPGA 132 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
132
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
225-LFBGA, CSPBGA
Supplier Device Package:
225-CSPBGA (13×13)
1,149
XC6SLX4-3CSG225IXC6SLX4-3CSG225IAdvanced Micro DevicesIC FPGA 132 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
132
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
225-LFBGA, CSPBGA
Supplier Device Package:
225-CSPBGA (13×13)
29
XC6SLX4-3TQG144CXC6SLX4-3TQG144CAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
102
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Qualification:
N/A
Total RAM Bits:
221184
170
XC6SLX4-3TQG144IXC6SLX4-3TQG144IAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
102
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,336

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