Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC6SLX16-N3CSG225CXC6SLX16-N3CSG225CAdvanced Micro DevicesIC FPGA 160 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
160
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Qualification:
N/A
Total RAM Bits:
589824
621
XC6SLX16-N3CSG225IXC6SLX16-N3CSG225IAdvanced Micro DevicesIC FPGA 160 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
160
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Qualification:
N/A
Total RAM Bits:
589824
1,149
XC6SLX16-N3CSG324IXC6SLX16-N3CSG324IAdvanced Micro DevicesIC FPGA 232 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
232
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Qualification:
N/A
Total RAM Bits:
589824
192
XC6SLX16-N3FT256IXC6SLX16-N3FT256IAdvanced Micro DevicesIC FPGA 186 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
186
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Qualification:
N/A
Total RAM Bits:
589824
1,801
XC6SLX25-2CSG324CXC6SLX25-2CSG324CAdvanced Micro DevicesIC FPGA 226 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
226
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
917
XC6SLX25-2CSG324IXC6SLX25-2CSG324IAdvanced Micro DevicesIC FPGA 226 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
226
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
116
XC6SLX25-2FG484CXC6SLX25-2FG484CAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
266
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
961
XC6SLX25-2FG484IXC6SLX25-2FG484IAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
266
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
516
XC6SLX25-2FGG484CXC6SLX25-2FGG484CAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
266
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
33
XC6SLX25-2FGG484IXC6SLX25-2FGG484IAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
266
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
1,328
XC6SLX25-2FT256CXC6SLX25-2FT256CAdvanced Micro DevicesIC FPGA 186 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
186
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
1,837
XC6SLX25-2FT256IXC6SLX25-2FT256IAdvanced Micro DevicesIC FPGA 186 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
186
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
826
XC6SLX25-2FTG256CXC6SLX25-2FTG256CAdvanced Micro DevicesIC FPGA 186 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
186
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
172
XC6SLX25-2FTG256IXC6SLX25-2FTG256IAdvanced Micro DevicesIC FPGA 186 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
186
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
138
XC6SLX25-3CSG324CXC6SLX25-3CSG324CAdvanced Micro DevicesIC FPGA 226 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
226
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
100
XC6SLX25-3CSG324IXC6SLX25-3CSG324IAdvanced Micro DevicesIC FPGA 226 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
226
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
964
XC6SLX25-3FG484CXC6SLX25-3FG484CAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
266
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
441
XC6SLX25-3FG484IXC6SLX25-3FG484IAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
266
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
31
XC6SLX25-3FGG484CXC6SLX25-3FGG484CAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
266
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Qualification:
N/A
Total RAM Bits:
958464
1,211
XC6SLX25-3FGG484IXC6SLX25-3FGG484IAdvanced Micro DevicesIC FPGA 266 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
266
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,749

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