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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MCIMX6X3CVO08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17×17) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 1,276 | ||
| N/A | N/A | MCIMX6X3CVO08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17×17) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 25 | |
 | MCIMX6X3EVK10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1GHz, 227MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14×14) Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 1,685 | ||
 | N/A | MCIMX6X3EVK10ABR | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14×14) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 138 | |
 | N/A | MCIMX6X3EVK10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14×14) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 1,235 | |
 | N/A | MCIMX6X3EVK10ACR | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14×14) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 1,118 | |
 | MCIMX6X3EVN10AB | NXP Semiconductors | IC MPU 227MHZ/1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14×14) Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 308 | ||
| N/A | MCIMX6X3EVN10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17×17) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 382 | ||
 | MCIMX6X3EVO10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17×17) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 1,587 | ||
| N/A | MCIMX6X3EVO10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17×17) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | 1,863 | ||
 | MCIMX6X4AVM08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 1,689 | ||
 | N/A | MCIMX6X4AVM08ABR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 830 | |
 | MCIMX6X4AVM08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 516 | ||
| N/A | MCIMX6X4AVM08ACR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 330 | ||
 | MCIMX6X4CVM08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 299 | ||
| N/A | N/A | MCIMX6X4CVM08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 765 | |
 | MCIMX6X4EVM10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 209 | ||
 | MCIMX6X4EVM10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 227MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Package / Case: 529-LFBGA Supplier Device Package: 529-MAPBGA (19×19) Additional Interfaces: AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | 64 | ||
 | MCIMX6Y0CVM05AA | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14×14) Additional Interfaces: I2C, SPI, UART | 1,346 | ||
 | MCIMX6Y0CVM05AB | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14×14) Additional Interfaces: I2C, SPI, UART | 1,847 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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