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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
XCV200-4PQ240IAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
166
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
666
XCV200-5BG256I
XCV200-5BG256IAdvanced Micro DevicesIC FPGA 180 I/O 256BGAFPGAs256-PBGA (27x27)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
180
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (27×27)
566
N/AXCV200-5BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
260
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
808
N/A
XCV200-5BG352IAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
260
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
1,388
XCV200-5FG256CXCV200-5FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
176
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
1,434
XCV200-5FG256I
XCV200-5FG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
176
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
968
XCV200-5FG456C
XCV200-5FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
284
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,180
N/A
XCV200-5PQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
166
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
629
N/A
XCV200-5PQ240IAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
166
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
596
N/AXCV200-6BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
260
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
431
XCV200-6FG256C
XCV200-6FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
176
Number of Gates:
236666
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
1,174
XCV200-6FG456CXCV200-6FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
284
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
1,212
N/AXCV200-6PQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
236666
Number of I/O:
166
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
57344
516
N/A
XCV2000E-6BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
970
N/A
XCV2000E-6BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
1,095
N/AXCV2000E-6FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
2541952
Number of I/O:
804
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
842
N/A
XCV2000E-6FG1156IAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
804
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA
Supplier Device Package:
1156-FBGA (35×35)
175
N/AXCV2000E-6FG680CAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
2541952
Number of I/O:
512
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
559
N/AXCV2000E-6FG680IAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
2541952
Number of I/O:
512
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
287
N/AXCV2000E-6FG860IAdvanced Micro DevicesIC FPGA 660 I/O 860FBGAFPGAs860-FBGA (42.5x42.5)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
2541952
Number of I/O:
660
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
358

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