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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6X1CVK08ACMCIMX6X1CVK08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
820
MCIMX6X1CVO08ABMCIMX6X1CVO08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,487
N/AMCIMX6X1CVO08ABRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,766
N/AMCIMX6X1CVO08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
841
N/AMCIMX6X1CVO08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,043
MCIMX6X1EVK10ABMCIMX6X1EVK10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
55
MCIMX6X1EVK10ACMCIMX6X1EVK10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
526
MCIMX6X1EVO10ABMCIMX6X1EVO10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
402
N/AMCIMX6X1EVO10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
117
MCIMX6X2AVN08ABMCIMX6X2AVN08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
663
N/AMCIMX6X2AVN08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,444
MCIMX6X2CVN08ABMCIMX6X2CVN08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
293
N/AMCIMX6X2CVN08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
134
MCIMX6X2EVN10ABMCIMX6X2EVN10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
538
MCIMX6X2EVN10ABRMCIMX6X2EVN10ABRNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
571
N/AMCIMX6X2EVN10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
272
N/AMCIMX6X3CVK08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, LPDDR2, LVDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
1,248
N/AMCIMX6X3CVK08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, LPDDR2, LVDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
331
MCIMX6X3CVN08ABMCIMX6X3CVN08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
920
N/AMCIMX6X3CVN08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
207

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