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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
MCIMX6X1CVK08AC
MCIMX6X1CVK08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,244
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QUOTE
MCIMX6X1CVO08AB
MCIMX6X1CVO08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
512
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QUOTE
N/A
MCIMX6X1CVO08ABRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,219
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QUOTE
N/A
MCIMX6X1CVO08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
675
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QUOTE
N/A
MCIMX6X1CVO08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,293
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QUOTE
MCIMX6X1EVK10AB
MCIMX6X1EVK10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
796
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QUOTE
MCIMX6X1EVK10AC
MCIMX6X1EVK10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
407
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QUOTE
MCIMX6X1EVO10AB
MCIMX6X1EVO10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,088
GET A
QUOTE
N/A
MCIMX6X1EVO10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
221
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QUOTE
MCIMX6X2AVN08AB
MCIMX6X2AVN08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
440
GET A
QUOTE
N/A
MCIMX6X2AVN08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
1,281
GET A
QUOTE
MCIMX6X2CVN08AB
MCIMX6X2CVN08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
1,156
GET A
QUOTE
N/A
MCIMX6X2CVN08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
1,378
GET A
QUOTE
MCIMX6X2EVN10AB
MCIMX6X2EVN10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
944
GET A
QUOTE
MCIMX6X2EVN10ABR
MCIMX6X2EVN10ABRNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
109
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QUOTE
N/AN/AMCIMX6X2EVN10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
849
GET A
QUOTE
N/A
MCIMX6X3CVK08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, LPDDR2, LVDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,190
GET A
QUOTE
N/A
MCIMX6X3CVK08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, LPDDR2, LVDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
61
GET A
QUOTE
MCIMX6X3CVN08AB
MCIMX6X3CVN08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
270
GET A
QUOTE
N/A
MCIMX6X3CVN08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
368
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