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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
R9A07G044L17GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,089
GET A
QUOTE
N/A
R9A07G044L17GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,002
GET A
QUOTE
N/A
R9A07G044L18GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
51
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QUOTE
N/A
R9A07G044L18GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
156
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QUOTE
R9A07G044L23GBG#AC0
R9A07G044L23GBG#AC0RenesasIC MPU 1.2GHZ 456BGAMicroprocessors456-BGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4, ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
456-BGA
Supplier Device Package:
456-BGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
56
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QUOTE
R9A07G044L23GBG#BC0
R9A07G044L23GBG#BC0RenesasSOC RZ/G2L 15MMBGA NON-SECUE DUAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
429
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QUOTE
N/A
R9A07G044L23GBG#YJ0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,260
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QUOTE
R9A07G044L24GBG#AC0
R9A07G044L24GBG#AC0RenesasIC MPU 1.2GHZ 551BGAMicroprocessors551-BGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4, ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
551-BGA
Supplier Device Package:
551-BGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
802
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QUOTE
R9A07G044L24GBG#BC0
R9A07G044L24GBG#BC0RenesasSOC RZ/G2L 21MMBGA NON-SECUE DUAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,343
GET A
QUOTE
N/A
R9A07G044L24GBG#YJ0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
578
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QUOTE
N/A
R9A07G044L27GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,172
GET A
QUOTE
N/A
R9A07G044L27GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,515
GET A
QUOTE
N/A
R9A07G044L28GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
390
GET A
QUOTE
N/A
R9A07G044L28GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
709
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QUOTE
N/A
R9A07G054L13GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
499
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QUOTE
N/A
R9A07G054L13GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
715
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QUOTE
N/A
R9A07G054L14GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
51
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QUOTE
N/A
R9A07G054L14GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 551BGAMicroprocessors551-LFBGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
551-LFBGA
Supplier Device Package:
551-LFBGA (21×21)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
400
GET A
QUOTE
N/A
R9A07G054L17GBG#AC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,549
GET A
QUOTE
N/A
R9A07G054L17GBG#BC0RenesasIC MPU RZ 200MHZ/1.2GHZ 456BGAMicroprocessors456-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
200MHz, 1.2GHz
Co-Processors/DSP:
ARM® Mali-G31, Multimedia; NEON™ SIMD
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
456-LFBGA
Supplier Device Package:
456-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
119
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QUOTE

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