 | | 5SGXMB9R2H43I3LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 1,044 | |
 | | 5SGXMB9R2H43I3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 761 | |
 | N/A | 5SGXMB9R3H43C2G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,503 | |
 | | 5SGXMB9R3H43C2LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 1,424 | |
 | | 5SGXMB9R3H43C2LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 486 | |
 | | 5SGXMB9R3H43C2N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 500 | |
 | N/A | 5SGXMB9R3H43C3G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,442 | |
 | | 5SGXMB9R3H43C3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 523 | |
 | N/A | 5SGXMB9R3H43C4G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 384 | |
 | | 5SGXMB9R3H43C4N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,210 | |
 | N/A | 5SGXMB9R3H43I3G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 840 | |
 | N/A | 5SGXMB9R3H43I3LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,314 | |
 | | 5SGXMB9R3H43I3LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 25 | |
 | | 5SGXMB9R3H43I3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 612 | |
 | N/A | 5SGXMB9R3H43I4G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 682 | |
 | | 5SGXMB9R3H43I4N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 1,142 | |
 | | 5SGXMBBR1H43C2G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 | 630 | |
 | N/A | 5SGXMBBR1H43C2LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 745 | |
 | | 5SGXMBBR1H43C2LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,683 | |
 | | 5SGXMBBR1H43C2N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,323 | |