Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC4062XL-1HQ304CN/AXC4062XL-1HQ304CAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
256
Number of Gates:
62000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
304-BFQFP Exposed Pad
Supplier Device Package:
304-PQFP (40×40)
403
XC4062XL-1HQ304IN/AXC4062XL-1HQ304IAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
256
Number of Gates:
62000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
304-BFQFP Exposed Pad
Supplier Device Package:
304-PQFP (40×40)
431
N/AN/AXC4062XL-2BG432CAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
62000
Number of I/O:
352
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
1,106
N/AN/AXC4062XL-2BG432IAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
62000
Number of I/O:
352
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
534
N/AN/AXC4062XL-2HQ240CAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
62000
Number of I/O:
193
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
174
N/AN/AXC4062XL-2HQ240IAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
193
Number of Gates:
62000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
240-BFQFP Exposed Pad
Supplier Device Package:
240-PQFP (32×32)
1,065
XC4062XL-2HQ304CN/AXC4062XL-2HQ304CAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
256
Number of Gates:
62000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
304-BFQFP Exposed Pad
Supplier Device Package:
304-PQFP (40×40)
212
N/AN/AXC4062XL-3BG432CAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
62000
Number of I/O:
352
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
221
N/AN/AXC4062XL-3BG432IAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
62000
Number of I/O:
352
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
1,296
N/AN/AXC4062XL-3HQ240CAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
193
Number of Gates:
62000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP Exposed Pad
Supplier Device Package:
240-PQFP (32×32)
143
XC4062XL-3HQ240C0624XC4062XL-3HQ240C0624Advanced Micro DevicesFPGA, 2304 CLBS, 40000 GATESFPGAs240-PQFP (32x32)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
193
Number of Gates:
40000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP Exposed Pad
Supplier Device Package:
240-PQFP (32×32)
669
N/AN/AXC4062XL-3HQ240IAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
62000
Number of I/O:
193
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
1,249
XC4062XL-3HQ304CN/AXC4062XL-3HQ304CAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
62000
Number of I/O:
256
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Qualification:
N/A
Total RAM Bits:
73728
960
XC4062XL-3HQ304IN/AXC4062XL-3HQ304IAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2304
Number of Logic Elements/Cells:
5472
Total RAM Bits:
73728
Number of I/O:
256
Number of Gates:
62000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
304-BFQFP Exposed Pad
Supplier Device Package:
304-PQFP (40×40)
1,308
N/AN/AXC4085XL-09BG432CAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3136
Number of Logic Elements/Cells:
7448
Total RAM Bits:
100352
Number of I/O:
352
Number of Gates:
85000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
1,134
N/AN/AXC4085XL-09BG560CAdvanced Micro DevicesIC FPGA 448 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
85000
Number of I/O:
448
Number of LABs/CLBs:
3136
Number of Logic Elements/Cells:
7448
Qualification:
N/A
Total RAM Bits:
100352
621
N/AN/AXC4085XL-1BG432IAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
85000
Number of I/O:
352
Number of LABs/CLBs:
3136
Number of Logic Elements/Cells:
7448
Qualification:
N/A
Total RAM Bits:
100352
196
N/AN/AXC4085XL-1BG560CAdvanced Micro DevicesIC FPGA 448 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3136
Number of Logic Elements/Cells:
7448
Total RAM Bits:
100352
Number of I/O:
448
Number of Gates:
85000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
1,369
N/AN/AXC4085XL-2BG432CAdvanced Micro DevicesIC FPGA 352 I/O 432MBGAFPGAs432-MBGA (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3136
Number of Logic Elements/Cells:
7448
Total RAM Bits:
100352
Number of I/O:
352
Number of Gates:
85000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
542
N/AN/AXC4085XL-2BG560CAdvanced Micro DevicesIC FPGA 448 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3136
Number of Logic Elements/Cells:
7448
Total RAM Bits:
100352
Number of I/O:
448
Number of Gates:
85000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
212

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