Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC888LM6FFA5VACKXUMA1XC888LM6FFA5VACKXUMA1Infineon TechnologiesIC MCU 8BIT 24KB FLASH 64TQFPMicrocontrollersPG-TQFP-64N/A-40°C ~ 125°C (TA)
Core Processor:
XC800
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
LINbus, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
FLASH
RAM Size:
1.75K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-64
Package / Case:
64-LQFP
920
XC888LM8FFI5VACFXUMA1XC888LM8FFI5VACFXUMA1Infineon TechnologiesIC MCU 8BIT 32KB FLASH 64TQFPMicrocontrollersPG-TQFP-64N/A-40°C ~ 85°C (TA)
Core Processor:
XC800
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
LINbus, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1.75K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-64
Package / Case:
64-LQFP
883
XC912BC32CFUE8XC912BC32CFUE8NXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
768 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
15
XCAU10P-1FFVB676EXCAU10P-1FFVB676EAdvanced Micro DevicesIC FPGA ARTIXUP 676BGAFPGAs676-FCBGA (27x27)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
447
XCAU10P-1FFVB676IXCAU10P-1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP 676BGAFPGAs676-FCBGA (27x27)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
228
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,120
XCAU10P-1SBVB484EXCAU10P-1SBVB484EAdvanced Micro DevicesIC FPGA ARTIXUP 484BGAFPGAs484-FCBGA (19x19)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
544
XCAU10P-1SBVB484IXCAU10P-1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP 484BGAFPGAs484-FCBGA (19x19)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
1,486
XCAU10P-1UBVA368EXCAU10P-1UBVA368EAdvanced Micro DevicesIC FPGA ARTIXUP 368BGAFPGAs368-FCBGA (10.5x10.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
128
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
423
XCAU10P-1UBVA368IXCAU10P-1UBVA368IAdvanced Micro DevicesIC FPGA ARTIXUP 368BGAFPGAs368-FCBGA (10.5x10.5)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
128
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
368-WFBGA, FCBGA
Supplier Device Package:
368-FCBGA (10.5×10.5)
1,558
XCAU10P-2FFVB676EXCAU10P-2FFVB676EAdvanced Micro DevicesIC FPGA ARTIXUP 676BGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
228
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,937
XCAU10P-2FFVB676IXCAU10P-2FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP 676BGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
158
XCAU10P-2SBVB484EXCAU10P-2SBVB484EAdvanced Micro DevicesIC FPGA ARTIXUP 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
220
XCAU10P-2SBVB484IXCAU10P-2SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
1,187
XCAU10P-2UBVA368EXCAU10P-2UBVA368EAdvanced Micro DevicesIC FPGA ARTIXUP 368BGAFPGAs368-FCBGA (10.5x10.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
128
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
101
XCAU10P-2UBVA368IXCAU10P-2UBVA368IAdvanced Micro DevicesIC FPGA ARTIXUP 368BGAFPGAs368-FCBGA (10.5x10.5)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
128
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
811
XCAU10P-L1FFVB676IXCAU10P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP LP 676BGAFPGAs676-FCBGA (27x27)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
228
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
335
XCAU10P-L1SBVB484IXCAU10P-L1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP LP 484BGAFPGAs484-FCBGA (19x19)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
155
XCAU10P-L1UBVA368IXCAU10P-L1UBVA368IAdvanced Micro DevicesIC FPGA ARTIXUP LP 368BGAFPGAs368-FCBGA (10.5x10.5)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
128
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
N/A
Total RAM Bits:
3670016
1,321
XCAU15P-1FFVB676EXCAU15P-1FFVB676EAdvanced Micro DevicesIC FPGA ARTIXUP 676BGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Total RAM Bits:
5347738
Number of I/O:
228
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
358
XCAU15P-1FFVB676IXCAU15P-1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP 676BGAFPGAs676-FCBGA (27x27)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
N/A
Total RAM Bits:
5347738
619

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up