Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCAU20P-2SFVB784IXCAU20P-2SFVB784IAdvanced Micro DevicesIC FPGA ARTIXUP 784FBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
156
Number of LABs/CLBs:
13625
Number of Logic Elements/Cells:
238437
Qualification:
N/A
Total RAM Bits:
3355443
264
XCAU20P-L1FFVB676IXCAU20P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIX UP LP 676FCBGAFPGAs676-FCBGA (27x27)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
13625
Number of Logic Elements/Cells:
238437
Qualification:
N/A
Total RAM Bits:
7340032
448
XCAU20P-L1SFVB784IXCAU20P-L1SFVB784IAdvanced Micro DevicesIC FPGA ARTIX UP LP 784FCBGAFPGAs784-FCBGA (23x23)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
13625
Number of Logic Elements/Cells:
238437
Qualification:
N/A
Total RAM Bits:
7340032
1,280
XCAU25P-1FFVB676EXCAU25P-1FFVB676EAdvanced Micro DevicesIC FPGA ARTIX UP 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Total RAM Bits:
11010048
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
455
XCAU25P-1FFVB676IN/AXCAU25P-1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP 676FBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Total RAM Bits:
4928307
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
525
XCAU25P-1SFVB784EXCAU25P-1SFVB784EAdvanced Micro DevicesIC FPGA ARTIX UP 784FCBGAFPGAs784-FCBGA (23x23)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Total RAM Bits:
11010048
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
617
XCAU25P-1SFVB784IXCAU25P-1SFVB784IAdvanced Micro DevicesIC FPGA ARTIX UP 784FCBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Qualification:
N/A
Total RAM Bits:
11010048
1,867
XCAU25P-2FFVB676EXCAU25P-2FFVB676EAdvanced Micro DevicesIC FPGA ARTIX UP 676FCBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Qualification:
N/A
Total RAM Bits:
11010048
472
XCAU25P-2FFVB676IXCAU25P-2FFVB676IAdvanced Micro DevicesIC FPGA ARTIX UP 676FCBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Qualification:
N/A
Total RAM Bits:
11010048
1,851
XCAU25P-2SFVB784EXCAU25P-2SFVB784EAdvanced Micro DevicesIC FPGA ARTIX UP 784FCBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Qualification:
N/A
Total RAM Bits:
11010048
767
XCAU25P-2SFVB784IXCAU25P-2SFVB784IAdvanced Micro DevicesIC FPGA ARTIXUP 784FBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Qualification:
N/A
Total RAM Bits:
4928307
780
XCAU25P-L1FFVB676IXCAU25P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIX UP LP 676FCBGAFPGAs676-FCBGA (27x27)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Qualification:
N/A
Total RAM Bits:
11010048
1,444
XCAU25P-L1SFVB784IXCAU25P-L1SFVB784IAdvanced Micro DevicesIC FPGA ARTIX UP LP 784FCBGAFPGAs784-FCBGA (23x23)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17625
Number of Logic Elements/Cells:
308437
Total RAM Bits:
11010048
Number of I/O:
304
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
186
N/AXCDAISY-FF1924Advanced Micro DevicesIC FPGAFPGAsN/AN/AN/A
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
N/A
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
N/A
Qualification:
N/A
Total RAM Bits:
N/A
580
XCKU025-1FFVA1156CXCKU025-1FFVA1156CAdvanced Micro DevicesIC FPGA 312 I/O 1156FCBGAFPGAs1156-FCBGA (35x35)0.922V ~ 0.979V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
18180
Number of Logic Elements/Cells:
318150
Total RAM Bits:
13004800
Number of I/O:
312
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35×35)
427
XCKU025-1FFVA1156IXCKU025-1FFVA1156IAdvanced Micro DevicesIC FPGA 312 I/O 1156FCBGAFPGAs1156-FCBGA (35x35)922 mV - 979 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
312
Number of LABs/CLBs:
18180
Number of Logic Elements/Cells:
318150
Qualification:
N/A
Total RAM Bits:
13004800
1,302
XCKU025-2FFVA1156EXCKU025-2FFVA1156EAdvanced Micro DevicesIC FPGA 312 I/O 1156FCBGAFPGAs1156-FCBGA (35x35)0.922V ~ 0.979V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
18180
Number of Logic Elements/Cells:
318150
Total RAM Bits:
13004800
Number of I/O:
312
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35×35)
351
XCKU025-2FFVA1156IXCKU025-2FFVA1156IAdvanced Micro DevicesIC FPGA 312 I/O 1156FCBGAFPGAs1156-FCBGA (35x35)0.922V ~ 0.979V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
18180
Number of Logic Elements/Cells:
318150
Total RAM Bits:
13004800
Number of I/O:
312
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35×35)
283
XCKU035-1FBVA676CXCKU035-1FBVA676CAdvanced Micro DevicesIC FPGA 312 I/O 676FCBGAFPGAs676-FCBGA (27x27)922 mV - 979 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
312
Number of LABs/CLBs:
25391
Number of Logic Elements/Cells:
444343
Qualification:
N/A
Total RAM Bits:
19456000
707
XCKU035-1FBVA676IXCKU035-1FBVA676IAdvanced Micro DevicesIC FPGA 312 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.922V ~ 0.979V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
25391
Number of Logic Elements/Cells:
444343
Total RAM Bits:
19456000
Number of I/O:
312
Voltage – Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
337

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