Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC7A35T-L1CPG236IXC7A35T-L1CPG236IAdvanced Micro DevicesIC FPGA 106 I/O 238CSBGAFPGAs238-CSBGA (10x10)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
106
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Qualification:
N/A
Total RAM Bits:
1843200
973
XC7A35T-L1CSG324IXC7A35T-L1CSG324IAdvanced Micro DevicesIC FPGA 210 I/O 324CSBGAFPGAs324-CSPBGA (15x15)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
210
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Qualification:
N/A
Total RAM Bits:
1843200
113
XC7A35T-L1CSG325I
XC7A35T-L1CSG325IAdvanced Micro DevicesIC FPGA 150 I/O 324CSBGAFPGAs324-CSPBGA (15x15)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Total RAM Bits:
1843200
Number of I/O:
150
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
315
XC7A35T-L1FGG484I
XC7A35T-L1FGG484IAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Total RAM Bits:
1843200
Number of I/O:
250
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
570
XC7A35T-L1FTG256IXC7A35T-L1FTG256IAdvanced Micro DevicesIC FPGA 170 I/O 256FTBGAFPGAs256-FTBGA (17x17)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
170
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Qualification:
N/A
Total RAM Bits:
1843200
1,392
XC7A35T-L2CPG236E
XC7A35T-L2CPG236EAdvanced Micro DevicesIC FPGA 106 I/O 238CSBGAFPGAs238-CSBGA (10x10)0.95V ~ 1.05V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Total RAM Bits:
1843200
Number of I/O:
106
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
238-LFBGA, CSPBGA
Supplier Device Package:
238-CSBGA (10×10)
867
XC7A35T-L2CSG324E
XC7A35T-L2CSG324EAdvanced Micro DevicesIC FPGA 210 I/O 324CSBGAFPGAs324-CSPBGA (15x15)0.95V ~ 1.05V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Total RAM Bits:
1843200
Number of I/O:
210
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
354
XC7A35T-L2CSG325EXC7A35T-L2CSG325EAdvanced Micro DevicesIC FPGA 150 I/O 324CSBGAFPGAs324-CSPBGA (15x15)950 mV - 1.05 V0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
150
Number of LABs/CLBs:
2600
Number of Logic Elements/Cells:
33280
Qualification:
N/A
Total RAM Bits:
1843200
543
XC7A35T-L2FGG484E
XC7A35T-L2FGG484EAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)0.95V - 1.05V0°C – 100°C
Number of I/O:
250
1,567
XC7A50T-1CPG236CXC7A50T-1CPG236CAdvanced Micro DevicesIC FPGA 106 I/O 238CSBGAFPGAs238-CSBGA (10x10)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
106
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Qualification:
N/A
Total RAM Bits:
2764800
119
XC7A50T-1CPG236IXC7A50T-1CPG236IAdvanced Micro DevicesIC FPGA 106 I/O 238CSBGAFPGAs238-CSBGA (10x10)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
106
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Qualification:
N/A
Total RAM Bits:
2764800
1,266
XC7A50T-1CS324IXC7A50T-1CS324IAdvanced Micro DevicesIC FPGA 210 I/O 324CSBGAFPGAs324-CSPBGA (15x15)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
210
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Qualification:
N/A
Total RAM Bits:
2764800
148
XC7A50T-1CSG324C
XC7A50T-1CSG324CAdvanced Micro DevicesIC FPGA 210 I/O 324CSBGAFPGAs324-CSPBGA (15x15)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
210
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
670
XC7A50T-1CSG324I
XC7A50T-1CSG324IAdvanced Micro DevicesIC FPGA 210 I/O 324CSBGAFPGAs324-CSPBGA (15x15)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
210
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
747
XC7A50T-1CSG325C
XC7A50T-1CSG325CAdvanced Micro DevicesIC FPGA 150 I/O 324CSBGAFPGAs324-CSPBGA (15x15)0.95V - 1.05V0°C – 85°C
Number of I/O:
150
231
XC7A50T-1CSG325I
XC7A50T-1CSG325IAdvanced Micro DevicesIC FPGA 150 I/O 324CSBGAFPGAs324-CSPBGA (15x15)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
150
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
604
XC7A50T-1FG484IXC7A50T-1FG484IAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
250
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Qualification:
N/A
Total RAM Bits:
2764800
781
XC7A50T-1FGG484CXC7A50T-1FGG484CAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
250
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Qualification:
N/A
Total RAM Bits:
2764800
37
XC7A50T-1FGG484I
XC7A50T-1FGG484IAdvanced Micro DevicesIC FPGA 250 I/O 484FBGAFPGAs484-FBGA (23x23)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
250
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
287
XC7A50T-1FTG256C
XC7A50T-1FTG256CAdvanced Micro DevicesIC FPGA 170 I/O 256FTBGAFPGAs256-FTBGA (17x17)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
170
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,142

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About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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