Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
5AGZME5K3F40C4N5AGZME5K3F40C4NIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)820 mV - 880 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
674
Number of LABs/CLBs:
18870
Number of Logic Elements/Cells:
400000
Qualification:
N/A
Total RAM Bits:
34322432
1,901
5AGZME5K3F40I4G
5AGZME5K3F40I4GIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
18870
Number of Logic Elements/Cells:
400000
Total RAM Bits:
34322432
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,150
5AGZME5K3F40I4N5AGZME5K3F40I4NIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
674
Number of LABs/CLBs:
18870
Number of Logic Elements/Cells:
400000
Qualification:
N/A
Total RAM Bits:
34322432
409
5AGZME7H2F35C3G
5AGZME7H2F35C3GIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.82V ~ 0.88V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
534
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
1,875
5AGZME7H2F35C3N
5AGZME7H2F35C3NIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.82V ~ 0.88V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
534
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
611
5AGZME7H2F35C3NCVN/A5AGZME7H2F35C3NCVIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)820 mV - 880 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
534
Number of LABs/CLBs:
169800
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
243
5AGZME7H2F35I3LG5AGZME7H2F35I3LGIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
534
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
392
5AGZME7H2F35I3LN
5AGZME7H2F35I3LNIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
534
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35×35)
613
5AGZME7H3F35C4G5AGZME7H3F35C4GIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)820 mV - 880 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
534
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
981
5AGZME7H3F35C4N5AGZME7H3F35C4NIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)820 mV - 880 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
534
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
558
5AGZME7H3F35I4G5AGZME7H3F35I4GIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
534
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
20
5AGZME7H3F35I4N5AGZME7H3F35I4NIntelIC FPGA 534 I/O 1152FBGAFPGAs1152-FBGA (35x35)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
534
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
354
5AGZME7K2F40C3G
5AGZME7K2F40C3GIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,241
5AGZME7K2F40C3N5AGZME7K2F40C3NIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)820 mV - 880 mV0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
674
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
1,034
5AGZME7K2F40I3LG
5AGZME7K2F40I3LGIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
235
5AGZME7K2F40I3LN
5AGZME7K2F40I3LNIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,891
5AGZME7K3F40C4G
5AGZME7K3F40C4GIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,973
5AGZME7K3F40C4N
5AGZME7K3F40C4NIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
401
5AGZME7K3F40I4G5AGZME7K3F40I4GIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
674
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Qualification:
N/A
Total RAM Bits:
40249344
1,420
5AGZME7K3F40I4N
5AGZME7K3F40I4NIntelIC FPGA 674 I/O 1517FBGAFPGAs1517-FBGA (40x40)0.82V ~ 0.88V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
21225
Number of Logic Elements/Cells:
450000
Total RAM Bits:
40249344
Number of I/O:
674
Voltage – Supply:
0.82V ~ 0.88V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA (40×40)
1,319

Featured Brands

About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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