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| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | 5SGSED8N3F45I3LG | Intel | IC FPGA 840 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 840 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45×45) | 1,445 | |
 | 5SGSED8N3F45I3LN | Intel | IC FPGA 840 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 840 Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Qualification: N/A Total RAM Bits: 51200000 | 626 | ||
 | 5SGSED8N3F45I3N | Intel | IC FPGA 840 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 840 Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Qualification: N/A Total RAM Bits: 51200000 | 205 | ||
 | N/A | 5SGSED8N3F45I4G | Intel | IC FPGA 840 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 840 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45×45) | 933 | |
 | 5SGSED8N3F45I4N | Intel | IC FPGA 840 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 840 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45×45) | 1,363 | ||
| N/A | N/A | 5SGSED8N3F46I3G | Intel | IC FPGA STRATIX V GS 1932-FBGA | FPGAs | - | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 52428800 Voltage – Supply: 0.82V ~ 0.88V Operating Temperature: -40°C ~ 100°C (TJ) | 1,372 | |
| N/A | N/A | 5SGSED8N3F46I3N | Intel | IC FPGA STRATIX V GS FLIP CHIP | FPGAs | - | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 52428800 Voltage – Supply: 0.82V ~ 0.88V Operating Temperature: -40°C ~ 100°C (TJ) | 628 | |
 | 5SGSMD3E1H29C1G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,089 | ||
 | 5SGSMD3E1H29C1N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 138 | ||
 | 5SGSMD3E1H29C1WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 130 | ||
 | N/A | 5SGSMD3E1H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 183 | |
 | 5SGSMD3E1H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 637 | ||
 | 5SGSMD3E1H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 54 | ||
 | 5SGSMD3E1H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 366 | ||
 | 5SGSMD3E1H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 991 | ||
 | 5SGSMD3E1H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,100 | ||
 | 5SGSMD3E1H29I2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,704 | ||
 | 5SGSMD3E1H29I2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 841 | ||
 | N/A | 5SGSMD3E1H29I2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 889 | |
 | N/A | 5SGSMD3E2H29C1G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,148 |
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