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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S250E-5VQG100CXC3S250E-5VQG100CAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
250000
Number of I/O:
66
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
N/A
Total RAM Bits:
221184
586
XC3S400-4FG320CXC3S400-4FG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
221
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
805
XC3S400-4FG320IXC3S400-4FG320IAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
400000
Number of I/O:
221
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
420
XC3S400-4FG456CXC3S400-4FG456CAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
264
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
646
XC3S400-4FG456IXC3S400-4FG456IAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
264
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
795
XC3S400-4FGG320CXC3S400-4FGG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
221
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
170
XC3S400-4FGG320IXC3S400-4FGG320IAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
400000
Number of I/O:
221
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
1,391
XC3S400-4FGG456CXC3S400-4FGG456CAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
264
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
840
XC3S400-4FGG456IXC3S400-4FGG456IAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
264
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,055
XC3S400-4FT256CXC3S400-4FT256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
173
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
251
XC3S400-4FT256IXC3S400-4FT256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
173
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,141
XC3S400-4FTG256CXC3S400-4FTG256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
173
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
872
XC3S400-4FTG256IXC3S400-4FTG256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
400000
Number of I/O:
173
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
488
XC3S400-4PQ208CXC3S400-4PQ208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
603
XC3S400-4PQ208IXC3S400-4PQ208IAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
400000
Number of I/O:
141
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
675
XC3S400-4PQG208CXC3S400-4PQG208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
135
XC3S400-4PQG208IXC3S400-4PQG208IAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
920
N/AXC3S400-4TQ144CAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,955
N/AXC3S400-4TQ144IAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,667
XC3S400-4TQG144CXC3S400-4TQG144CAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,139

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