 | | LCMXO3D-9400HC-6BG256C | Lattice Semiconductor Corporation | IC FPGA 206 I/O 256CABGA | FPGAs | 256-CABGA (14x14) | 2.375V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-CABGA (14×14) | 1,858 | |
 | | LCMXO3D-9400HC-6BG256I | Lattice Semiconductor Corporation | IC FPGA 206 I/O 256CABGA | FPGAs | 256-CABGA (14x14) | 2.375 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 9400 | 1,452 | |
 | | LCMXO3D-9400HC-6BG400C | Lattice Semiconductor Corporation | IC FPGA 335 I/O 400CABGA | FPGAs | 400-CABGA (17x17) | 2.375 V - 3.465 V | 0°C – 85°C | Number of Logic Elements/Cells: 9400 | 812 | |
 | | LCMXO3D-9400HC-6BG400I | Lattice Semiconductor Corporation | IC FPGA 335 I/O 400CABGA | FPGAs | 400-CABGA (17x17) | 2.375V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 400-CABGA (17×17) | 354 | |
 | | LCMXO3D-9400HC-6BG484C | Lattice Semiconductor Corporation | IC FPGA MACHXO3D 9400LUT 484BGA | FPGAs | 484-CABGA (19x19) | 2.375V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-CABGA (19×19) | 895 | |
 | | LCMXO3D-9400HC-6BG484I | Lattice Semiconductor Corporation | IC FPGA MACHXO3D 9400LUT 484BGA | FPGAs | 484-CABGA (19x19) | 2.375 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 9400 | 1,146 | |
 | | LCMXO3D-9400HC-6SG72C | Lattice Semiconductor Corporation | IC FPGA 58 I/O 72QFN | FPGAs | 72-QFN (10x10) | 2.375 V - 3.465 V | 0°C – 85°C | Number of Logic Elements/Cells: 9400 | 764 | |
 | | LCMXO3D-9400HC-6SG72I | Lattice Semiconductor Corporation | IC FPGA 58 I/O 72QFN | FPGAs | 72-QFN (10x10) | 2.375V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 72-VFQFN Exposed Pad Supplier Device Package: 72-QFN (10×10) | 1,256 | |
| N/A | | LCMXO3D-9400HE-5UTG69CTR | Lattice Semiconductor Corporation | IC FPGA MACHXO3D 69WLCSP | FPGAs | 69-WLCSP (5.19x6.22) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 69-WFBGA, WLCSP Supplier Device Package: 69-WLCSP (5.19×6.22) | 898 | |
| N/A | | LCMXO3D-9400HE-5UTG69CTR1K | Lattice Semiconductor Corporation | IC FPGA MACHXO3D 69WLCSP | FPGAs | 69-WLCSP (5.19x6.22) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 69-WFBGA, WLCSP Supplier Device Package: 69-WLCSP (5.19×6.22) | 1,094 | |
| N/A | | LCMXO3D-9400HE-5UTG69ITR | Lattice Semiconductor Corporation | IC FPGA MACHXO3D 69WLCSP | FPGAs | 69-WLCSP (5.19x6.22) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 9400 | 1,899 | |
| N/A | | LCMXO3D-9400HE-5UTG69ITR1K | Lattice Semiconductor Corporation | IC FPGA MACHXO3D 69WLCSP | FPGAs | 69-WLCSP (5.19x6.22) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 69-WFBGA, WLCSP Supplier Device Package: 69-WLCSP (5.19×6.22) | 218 | |
 | | LCMXO3D-9400ZC-2BG256C | Lattice Semiconductor Corporation | IC FPGA 206 I/O 256CABGA | FPGAs | 256-CABGA (14x14) | 2.375V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-CABGA (14×14) | 1,111 | |
 | | LCMXO3D-9400ZC-2BG256I | Lattice Semiconductor Corporation | IC FPGA 206 I/O 256CABGA | FPGAs | 256-CABGA (14x14) | 2.375 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 9400 | 1,487 | |
 | | LCMXO3D-9400ZC-2BG400C | Lattice Semiconductor Corporation | IC FPGA 335 I/O 400CABGA | FPGAs | 400-CABGA (17x17) | 2.375V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 400-CABGA (17×17) | 48 | |
 | | LCMXO3D-9400ZC-2BG400I | Lattice Semiconductor Corporation | IC FPGA 335 I/O 400CABGA | FPGAs | 400-CABGA (17x17) | 2.375V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 400-CABGA (17×17) | 1,211 | |
 | | LCMXO3D-9400ZC-2SG72C | Lattice Semiconductor Corporation | IC FPGA 58 I/O 72QFN | FPGAs | 72-QFN (10x10) | 2.375V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 72-VFQFN Exposed Pad Supplier Device Package: 72-QFN (10×10) | 1,594 | |
 | | LCMXO3D-9400ZC-2SG72I | Lattice Semiconductor Corporation | IC FPGA 58 I/O 72QFN | FPGAs | 72-QFN (10x10) | 2.375 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 9400 | 618 | |
 | | LCMXO3D-9400ZC-3BG256C | Lattice Semiconductor Corporation | IC FPGA 206 I/O 256CABGA | FPGAs | 256-CABGA (14x14) | 2.375V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-CABGA (14×14) | 860 | |
 | | LCMXO3D-9400ZC-3BG256I | Lattice Semiconductor Corporation | IC FPGA 206 I/O 256CABGA | FPGAs | 256-CABGA (14x14) | 2.375V ~ 3.465V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 9400 Voltage – Supply: 2.375V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-CABGA (14×14) | 1 | |