 | | AX500-2FGG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,720 | |
 | | AX500-2FGG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 568 | |
 | | AX500-2FGG676 | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 676-FBGA (27×27) | 511 | |
 | | AX500-2FGG676I | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 676-FBGA (27×27) | 1,069 | |
 | | AX500-2PQ208 | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 208-PQFP (28×28) | 797 | |
 | | AX500-2PQ208I | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,594 | |
 | | AX500-2PQG208 | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 208-PQFP (28×28) | 238 | |
 | | AX500-2PQG208I | Microchip Technology | IC FPGA 115 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,135 | |
| N/A | | AX500-CQ208M | Microchip Technology | IC FPGA 115 I/O 208CQFP | FPGAs | 208-CQFP (75x75) | 1.425 V - 1.575 V | -55°C – 125°C | Number of Logic Elements/Cells: 8064 | 759 | |
 | | AX500-FG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 114 | |
 | | AX500-FG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 382 | |
 | | AX500-FG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 729 | |
 | | AX500-FG676 | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 676-FBGA (27×27) | 270 | |
 | | AX500-FG676I | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,277 | |
| N/A | | AX500-FG676M | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 676-FBGA (27×27) | 133 | |
 | | AX500-FGG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of Logic Elements/Cells: 8064 | 170 | |
 | | AX500-FGG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 1,054 | |
 | | AX500-FGG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,265 | |
 | | AX500-FGG676 | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 676-FBGA (27×27) | 239 | |
 | | AX500-FGG676I | Microchip Technology | IC FPGA 336 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -40°C – 85°C | Number of Logic Elements/Cells: 8064 | 938 | |