 | | XCV150-4BG256C | Advanced Micro Devices | IC FPGA 180 I/O 256BGA | FPGAs | 256-PBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 3888 | 588 | |
| N/A | | XCV150-4BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 321 | |
| N/A | | XCV150-4BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 969 | |
 | | XCV150-4FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 779 | |
 | | XCV150-4FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 137 | |
 | | XCV150-4FG456C | Advanced Micro Devices | IC FPGA 260 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 459 | |
 | | XCV150-4FG456I | Advanced Micro Devices | IC FPGA 260 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,200 | |
| N/A | | XCV150-4PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 861 | |
| N/A | | XCV150-4PQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 41 | |
 | | XCV150-5BG256I | Advanced Micro Devices | IC FPGA 180 I/O 256BGA | FPGAs | 256-PBGA (27x27) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-PBGA (27×27) | 429 | |
| N/A | | XCV150-5BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 3888 | 1,378 | |
| N/A | | XCV150-5BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 1,058 | |
 | | XCV150-5FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 833 | |
 | | XCV150-5FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 1,049 | |
 | | XCV150-5FG456C | Advanced Micro Devices | IC FPGA 260 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 623 | |
 | | XCV150-5FG456I | Advanced Micro Devices | IC FPGA 260 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 896 | |
| N/A | | XCV150-5PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 3888 | 577 | |
| N/A | | XCV150-5PQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 836 | |
 | | XCV150-6BG256C | Advanced Micro Devices | IC FPGA 180 I/O 256BGA | FPGAs | 256-PBGA (27x27) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-PBGA (27×27) | 223 | |
| N/A | | XCV150-6BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,281 | |