| N/A | | XCV1000-4BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 99 | |
| N/A | | XCV1000-4BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 27648 | 28 | |
| N/A | | XCV1000-4FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 27648 | 361 | |
| N/A | | XCV1000-5BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 561 | |
| N/A | | XCV1000-5BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,144 | |
| N/A | | XCV1000-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 27648 | 613 | |
| N/A | | XCV1000-6FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40×40) | 14 | |
| N/A | | XCV1000E-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 301 | |
| N/A | | XCV1000E-6BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 27648 | 35 | |
| N/A | | XCV1000E-6FG1156I | Advanced Micro Devices | IC FPGA 660 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 1156-FBGA (35×35) | 1,421 | |
| N/A | | XCV1000E-6FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 27648 | 509 | |
| N/A | | XCV1000E-6FG680I | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 27648 | 879 | |
 | | XCV1000E-6FG900C | Advanced Micro Devices | IC FPGA 660 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 27648 | 465 | |
 | | XCV1000E-6FG900I | Advanced Micro Devices | IC FPGA 660 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 27648 | 601 | |
| N/A | | XCV1000E-6HQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 991 | |
| N/A | | XCV1000E-7BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 27648 | 1,784 | |
| N/A | | XCV1000E-7BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 27648 | 50 | |
| N/A | | XCV1000E-7FG1156C | Advanced Micro Devices | IC FPGA 660 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 27648 | 596 | |
| N/A | | XCV1000E-7FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40×40) | 1,853 | |
| N/A | | XCV1000E-7FG860C | Advanced Micro Devices | IC FPGA 660 I/O 860FBGA | FPGAs | 860-FBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 860-BGA Exposed Pad Supplier Device Package: 860-FBGA (42.5×42.5) | 369 | |