 | | XCV150-6FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 3888 | 579 | |
 | | XCV150-6FG456C | Advanced Micro Devices | IC FPGA 260 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 3888 | 61 | |
| N/A | | XCV150-6PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 653 | |
| N/A | | XCV1600E-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 34992 | 1,193 | |
 | | XCV1600E-6FG900C | Advanced Micro Devices | IC FPGA 700 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 34992 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 900-FBGA (31×31) | 1,110 | |
 | | XCV1600E-6FG900I | Advanced Micro Devices | IC FPGA 700 I/O 900FBGA | FPGAs | 900-FBGA (31x31) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 34992 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 900-FBGA (31×31) | 343 | |
| N/A | | XCV1600E-7BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 34992 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,698 | |
| N/A | | XCV1600E-7FG1156C | Advanced Micro Devices | IC FPGA 724 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 34992 | 1,108 | |
| N/A | | XCV1600E-7FG860C | Advanced Micro Devices | IC FPGA 660 I/O 860FBGA | FPGAs | 860-FBGA (42.5x42.5) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 34992 | 370 | |
| N/A | | XCV1600E-8BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 34992 | 1,281 | |
 | | XCV200-4BG256C | Advanced Micro Devices | IC FPGA 180 I/O 256BGA | FPGAs | 256-PBGA (27x27) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-PBGA (27×27) | 679 | |
| N/A | | XCV200-4BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,110 | |
| N/A | | XCV200-4BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 36 | |
 | | XCV200-4FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,002 | |
 | | XCV200-4FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 943 | |
 | | XCV200-4FG456C | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,743 | |
 | | XCV200-4FG456I | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 1,490 | |
| N/A | | XCV200-4PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,623 | |
| N/A | | XCV200-4PQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 591 | |
 | | XCV200-5BG256I | Advanced Micro Devices | IC FPGA 180 I/O 256BGA | FPGAs | 256-PBGA (27x27) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-PBGA (27×27) | 509 | |