| N/A | | XCV2000E-7FG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 1156-FBGA (35×35) | 1,005 | |
| N/A | | XCV2000E-7FG1156I | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 1156-FBGA (35×35) | 1,061 | |
| N/A | | XCV2000E-7FG860C | Advanced Micro Devices | IC FPGA 660 I/O 860FBGA | FPGAs | 860-FBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 860-BGA Exposed Pad Supplier Device Package: 860-FBGA (42.5×42.5) | 663 | |
| N/A | | XCV2000E-8BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 681 | |
| N/A | | XCV2000E-8FG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 43200 | 832 | |
| N/A | | XCV2000E-8FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40×40) | 469 | |
| N/A | | XCV200E-6BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,078 | |
 | | XCV200E-6FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 95 | |
 | | XCV200E-6FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 57 | |
 | | XCV200E-6FG456C | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 520 | |
 | | XCV200E-6FG456I | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 231 | |
| N/A | | XCV200E-6PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,349 | |
| N/A | | XCV200E-6PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 781 | |
| N/A | | XCV200E-7BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 374 | |
| N/A | | XCV200E-7BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 1,108 | |
 | | XCV200E-7FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,054 | |
 | | XCV200E-7FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 264 | |
 | | XCV200E-7FG456C | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 888 | |
| N/A | | XCV200E-7PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 461 | |
| N/A | | XCV200E-7PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,787 | |