| N/A | | XCV200E-8BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,161 | |
 | | XCV200E-8FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 337 | |
 | | XCV200E-8FG456C | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 755 | |
 | | XCV200E-8PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,156 | |
| N/A | | XCV2600E-6FG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of LABs/CLBs: 12696 Number of Logic Elements/Cells: 57132 | 1,036 | |
| N/A | | XCV2600E-7FG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of LABs/CLBs: 12696 Number of Logic Elements/Cells: 57132 | 35 | |
| N/A | | XCV2600E-8FG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of LABs/CLBs: 12696 Number of Logic Elements/Cells: 57132 | 1,013 | |
| N/A | | XCV300-4BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,074 | |
| N/A | | XCV300-4BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 1,584 | |
| N/A | | XCV300-4BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,103 | |
 | | XCV300-4BG432C4307 | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 571 | |
| N/A | | XCV300-4BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 207 | |
 | | XCV300-4FG456C | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,679 | |
 | | XCV300-4FG456I | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 543 | |
| N/A | | XCV300-4PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 10 | |
| N/A | | XCV300-4PQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 19 | |
| N/A | | XCV300-5BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,142 | |
| N/A | | XCV300-5BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 562 | |
| N/A | | XCV300-5BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 723 | |
| N/A | | XCV300-5BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 692 | |