| N/A | | XCV300E-7BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 1,574 | |
| N/A | | XCV300E-7BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 1,785 | |
 | | XCV300E-7FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 844 | |
 | | XCV300E-7FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 495 | |
 | | XCV300E-7FG456C | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 846 | |
 | | XCV300E-7FG456C0773 | Advanced Micro Devices | VIRTEX FPGA, 1536CLBS | FPGAs | 456-FBGA (23x23) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 614 | |
 | | XCV300E-7FG456I | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,163 | |
| N/A | | XCV300E-7PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 105 | |
| N/A | | XCV300E-7PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 737 | |
| N/A | | XCV300E-8BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,017 | |
 | | XCV300E-8FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 1,927 | |
 | | XCV300E-8FG456C | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,087 | |
| N/A | | XCV300E-8PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 259 | |
| N/A | N/A | XCV3200E-6CG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156CBGA | FPGAs | 1156-CBGA (35x35) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 16224 Number of Logic Elements/Cells: 73008 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BCBGA Supplier Device Package: 1156-CBGA (35×35) | 830 | |
| N/A | N/A | XCV3200E-7CG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156CBGA | FPGAs | 1156-CBGA (35x35) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 16224 Number of Logic Elements/Cells: 73008 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BCBGA Supplier Device Package: 1156-CBGA (35×35) | 106 | |
| N/A | | XCV400-4BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,254 | |
| N/A | | XCV400-4BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 296 | |
| N/A | | XCV400-4BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 736 | |
| N/A | | XCV400-4BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 1,427 | |
 | | XCV400-4FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 297 | |