| N/A | | XCV400E-6PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,716 | |
| N/A | | XCV400E-6PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,541 | |
| N/A | | XCV400E-7BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 1,513 | |
 | | XCV400E-7BG432C0773 | Advanced Micro Devices | FPGA, 2400 CLBS, 468252 GATES, 2 | FPGAs | 432-MBGA (40x40) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,436 | |
| N/A | | XCV400E-7BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 151 | |
| N/A | | XCV400E-7BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,146 | |
| N/A | | XCV400E-7BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 119 | |
 | | XCV400E-7FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 567 | |
| N/A | | XCV400E-7PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1 | |
| N/A | | XCV400E-7PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 892 | |
| N/A | | XCV400E-8BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 943 | |
 | | XCV400E-8FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 236 | |
| N/A | | XCV400E-8PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,359 | |
| N/A | | XCV405E-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 759 | |
| N/A | | XCV405E-6BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 131 | |
 | | XCV405E-6FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 915 | |
 | | XCV405E-6FG676I | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,482 | |
| N/A | | XCV405E-7BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,794 | |
| N/A | | XCV405E-7BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 559 | |
 | | XCV405E-7FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,631 | |