 | | XCV400-4FG676I | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 992 | |
| N/A | | XCV400-4HQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,137 | |
 | | XCV400-4HQ240C0729 | Advanced Micro Devices | FPGA, 2400 CLBS, 468252 GATES, 2 | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 273 | |
| N/A | | XCV400-4HQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 1,038 | |
| N/A | | XCV400-5BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,975 | |
| N/A | | XCV400-5BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 783 | |
| N/A | | XCV400-5BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 1,702 | |
| N/A | | XCV400-5BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 10800 | 214 | |
 | | XCV400-5FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 569 | |
| N/A | | XCV400-5HQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 359 | |
| N/A | | XCV400-6BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 178 | |
| N/A | | XCV400-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 124 | |
 | | XCV400-6FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 869 | |
| N/A | | XCV400-6HQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 479 | |
| N/A | | XCV400E-6BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 676 | |
| N/A | | XCV400E-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 10800 | 631 | |
 | | XCV400E-6BG560C0773 | Advanced Micro Devices | FPGA, 2400 CLBS, 468252 GATES, 2 | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 705 | |
| N/A | | XCV400E-6BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 197 | |
 | | XCV400E-6FG676C | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 116 | |
 | | XCV400E-6FG676I | Advanced Micro Devices | IC FPGA 404 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 10800 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,349 | |