| N/A | | XCV200-5BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 808 | |
| N/A | | XCV200-5BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,388 | |
 | | XCV200-5FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,434 | |
 | | XCV200-5FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 821 | |
 | | XCV200-5FG456C | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,180 | |
| N/A | | XCV200-5PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 629 | |
| N/A | | XCV200-5PQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 303 | |
| N/A | | XCV200-6BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 431 | |
 | | XCV200-6FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 1,174 | |
 | | XCV200-6FG456C | Advanced Micro Devices | IC FPGA 284 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 1,212 | |
| N/A | | XCV200-6PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 5292 | 516 | |
| N/A | | XCV2000E-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 970 | |
| N/A | | XCV2000E-6BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,095 | |
| N/A | | XCV2000E-6FG1156C | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 43200 | 842 | |
| N/A | | XCV2000E-6FG1156I | Advanced Micro Devices | IC FPGA 804 I/O 1156FBGA | FPGAs | 1156-FBGA (35x35) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 1156-FBGA (35×35) | 175 | |
| N/A | | XCV2000E-6FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 43200 | 559 | |
| N/A | | XCV2000E-6FG680I | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 43200 | 287 | |
| N/A | | XCV2000E-6FG860I | Advanced Micro Devices | IC FPGA 660 I/O 860FBGA | FPGAs | 860-FBGA (42.5x42.5) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 43200 | 358 | |
| N/A | | XCV2000E-7BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,466 | |
| N/A | | XCV2000E-7BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 43200 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 582 | |