 | | 10CX105YU484E5G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 38000 Number of Logic Elements/Cells: 104000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,144 | |
 | | 10CX105YU484E6G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 38000 Number of Logic Elements/Cells: 104000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 166 | |
 | | 10CX105YU484I5G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 900 mV | -40°C – 100°C | Number of LABs/CLBs: 38000 Number of Logic Elements/Cells: 104000 | 434 | |
 | | 10CX105YU484I6G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 38000 Number of Logic Elements/Cells: 104000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 67 | |
 | | 10CX150YF672E5G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 578 | |
 | | 10CX150YF672E6G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 314 | |
 | | 10CX150YF672I5G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 900 mV | -40°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 308 | |
 | | 10CX150YF672I6G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 875 | |
 | | 10CX150YF780E5G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 1,872 | |
 | | 10CX150YF780E6G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 852 | |
 | | 10CX150YF780I5G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 900 mV | -40°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 315 | |
 | | 10CX150YF780I6G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29×29) | 947 | |
 | | 10CX150YU484E5G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,243 | |
 | | 10CX150YU484E6G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 | 1,567 | |
 | | 10CX150YU484I5G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,147 | |
 | | 10CX150YU484I6G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 54770 Number of Logic Elements/Cells: 150000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,216 | |
 | | 10CX220YF672E5G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 1,703 | |
 | N/A | 10CX220YF672E6G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27×27) | 899 | |
 | | 10CX220YF672I5G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27×27) | 88 | |
 | | 10CX220YF672I6G | Intel | IC FPGA 236 I/O 672FBGA | FPGAs | 672-FBGA, FC (27x27) | 900 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,277 | |