 | | 10CX220YF780E5G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 341 | |
 | | 10CX220YF780E6G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 574 | |
 | | 10CX220YF780I5G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA, FC (29x29) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA, FC (29×29) | 1,939 | |
 | | 10CX220YF780I6G | Intel | IC FPGA 284 I/O 780FBGA | FPGAs | 780-FBGA (29x29) | 900 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 1,009 | |
 | | 10CX220YU484E5G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 900 mV | 0°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 469 | |
 | | 10CX220YU484E6G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 512 | |
 | | 10CX220YU484I5G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 0.9V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-UBGA (19×19) | 1,616 | |
 | | 10CX220YU484I6G | Intel | IC FPGA 188 I/O 484UBGA | FPGAs | 484-UBGA (19x19) | 900 mV | -40°C – 100°C | Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 | 837 | |
 | | 10M02DCU324A7G | Intel | IC FPGA 160 I/O 324UBGA | FPGAs | 324-UBGA (15x15) | 1.15 V - 1.25 V | -40°C – 125°C | Number of Logic Elements/Cells: 2000 | 1,736 | |
 | | 10M02DCU324C8G | Intel | IC FPGA 160 I/O 324UBGA | FPGAs | 324-UBGA (15x15) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 324-UBGA (15×15) | 859 | |
 | | 10M02DCU324I7G | Intel | IC FPGA 160 I/O 324UBGA | FPGAs | 324-UBGA (15x15) | 1.15 V - 1.25 V | -40°C – 100°C | Number of Logic Elements/Cells: 2000 | 757 | |
 | | 10M02DCV36C7G | Intel | IC FPGA 27 I/O 36WLCSP | FPGAs | 36-VBGA (3.47x3.4) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 36-UFBGA, WLCSP Supplier Device Package: 36-VBGA (3.47×3.4) | 619 | |
 | | 10M02DCV36C8G | Intel | IC FPGA 27 I/O 36WLCSP | FPGAs | 36-VBGA (3.47x3.4) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 36-UFBGA, WLCSP Supplier Device Package: 36-VBGA (3.47×3.4) | 698 | |
 | | 10M02DCV36I7G | Intel | IC FPGA 27 I/O 36WLCSP | FPGAs | 36-VBGA (3.47x3.4) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2000 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 36-UFBGA, WLCSP Supplier Device Package: 36-VBGA (3.47×3.4) | 719 | |
 | | 10M02SCE144A7G | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85 V - 3.465 V | -40°C – 125°C | Number of Logic Elements/Cells: 2000 | 834 | |
 | | 10M02SCE144C7G | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85V ~ 3.465V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2000 Voltage – Supply: 2.85V ~ 3.465V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20×20) | 54 | |
 | | 10M02SCE144C8G | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85 V - 3.465 V | 0°C – 85°C | Number of Logic Elements/Cells: 2000 | 182 | |
 | | 10M02SCE144I7G | Intel | IC FPGA 101 I/O 144EQFP | FPGAs | 144-EQFP (20x20) | 2.85 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 2000 | 1,936 | |
 | | 10M02SCM153C8G | Intel | IC FPGA 112 I/O 153MBGA | FPGAs | 153-MBGA (8x8) | 2.85 V - 3.465 V | 0°C – 85°C | Number of Logic Elements/Cells: 2000 | 81 | |
 | | 10M02SCM153I7G | Intel | IC FPGA 112 I/O 153MBGA | FPGAs | 153-MBGA (8x8) | 2.85 V - 3.465 V | -40°C – 100°C | Number of Logic Elements/Cells: 2000 | 106 | |